Friable-resistant dielectric porcelain
AssigneeVictor Insulators, Inc.
InventorIra Knickerbocker
Life of this patent
Estimating the term…
Abstract
The present invention relates to a composition for forming a friable-resistant dielectric porcelain material. The present invention also relates to a friable-resistant dielectric porcelain material formed from the composition of the present invention, a method of making a friable-resistant dielectric porcelain material, a friable-resistant dielectric porcelain material formed by the method of the present invention, a dielectric porcelain material comprising a particular composition, and a system for producing ozone using the dielectric porcelain material of to the present invention.
Claims29
A method of making a friable-resistant dielectric porcelain material, said method comprising:
- providing an aqueous composition comprising water and either (A) or (B) as follows:
- (A)
- feldspar at about 21% to about 27% by weight, wherein at least 99.9% of the feldspar has a particle size less than about 72 microns and the feldspar has a potash to soda ratio of at least 10 to 1;
- calcined alumina at about 32% to about 38% by weight, wherein at least 99.9% of the calcined alumina has a particle size less than about 44 microns;
- and
- clay at about 37% to about 43% by weight, wherein at least 99.9% of the clay has a particle size less than about 22 microns;
- (B)
- feldspar at about 28% to about 34% by weight, wherein at least 99.9% of the feldspar has a particle size less than about 72 microns and the feldspar has a potash to soda ratio of at least about 10 to 1;
- crystalline silica at about 22% to about 28% by weight, wherein at least 99.9% of the crystalline silica has a particle size less than about 44 microns;
- and
- clay at about 41% to about 47% by weight, wherein at least 99.9% of the clay has a particle size less than about 22 microns;
- processing the aqueous composition to form a homogenous mixture;
- forming the homogenous mixture into a shaped article;
- and
- firing the shaped article in a kiln at a temperature of about 2012° F. (1100° C.) to about 2462° F. (1350° C.) to form a friable-resistant dielectric porcelain material.
A friable-resistant dielectric porcelain material formed from the composition (A) or (B) as follows:
- (A)
- feldspar at about 21% to about 27% by weight, wherein at least 99.9% of the feldspar has a particle size less than about 72 microns and the feldspar has a potash to soda ratio of at least 10 to 1;
- calcined alumina at about 32% to about 38% by weight, wherein at least 99.9% of the calcined alumina has a particle size less than about 44 microns;
- and
- clay at about 37% to about 43% by weight, wherein at least 99.9% of the clay has a particle size less than about 22 microns;
- (B)
- feldspar at about 28% to about 34% by weight, wherein at least 99.9% of the feldspar has a particle size less than about 72 microns and the feldspar has a potash to soda ratio of at least about 10 to 1;
- crystalline silica at about 22% to about 28% by weight, wherein at least 99.9% of the crystalline silica has a particle size less than about 44 microns;
- and
- clay at about 41% to about 47% by weight, wherein at least 99.9% of the clay has a particle size less than about 22 microns.
A method of making a friable-resistant dielectric porcelain material, said method comprising:
- providing a clay slurry comprising clay and water, wherein 99.9% by weight of the clay in the clay slurry has a particle size less than about 22 microns;
- adding to the clay slurry a feldspar flux material and a filler material to form an aqueous composition, wherein the feldspar flux material has a potash to soda ratio of at least 10 to 1;
- processing the aqueous composition to form a homogenous mixture;
- forming the homogenous mixture into a shaped article;
- and
- firing the shaped article at a temperature of about 2012° F. (1100° C.) to about 2462° F. (1350° C.) to form a friable-resistant dielectric porcelain material.
A dielectric porcelain material comprising (I) or (II) as follows:
- (I)
- about 5% to about 7% K2O,
- about 0.2% to about 0.6% Na2O,
- about 16% to about 20% Al2O3, and
- about 70% to about 75% SiO2 or
- (II)
- about 5% to about 6% K2O,
- about 0.2% to about 0.5% Na2O,
- about 50% to about 55% Al2O3, and
- about 40% to about 42% SiO2,
- wherein the material comprises less than about 1% by volume of individual crystals or closed pores greater than 22 microns in diameter and the material has zero apparent porosity.
Dependencies are inferred from the claim text.