# US 2015/0146969 A1 · Method for detecting a structure to be applied to a substrate with a plurality of optical image acquisition units and an apparatus therefor > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2015/0146969 A1 - Document ID: US20150146969A1 - Status: Published application - Kind: A1 - Application number: 14/402,743 - Filed: 2013-05-15 - Published: 2015-05-28 - Earliest claimed: 2012-05-21 - Assignees: Quiss QualitäTs-Inspektionssysteme Und Service GmbH - Applicants: Quiss Qualitats-Inspektionssysteme Und Service AG - Inventors: Bernhard Gruber - Web page: https://patentgrep.com/patent/US20150146969A1 ## CPC - G01N 21/88: Investigating the presence of flaws or contamination - G01N 21/8851: {Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges (G01N21/8806 and G01N21/93 - G01N21/95692 take precedence; optical measurement of dimensions G01B11/00; optical scanning G02B26/10; image transformation G06T3/00; computerised image enhancement G06T5/00; image processing per se for flaw detection G06T7/0002)} - G06T 7/001: {using an image reference approach} - G06T 7/74: {involving reference images or patches} - G06T 11/60: Creating or editing images; Combining images with text - H04N 23/60: Control of cameras or camera modules - H04N 23/45: for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images - H04N 23/56: provided with illuminating means - H04N 23/65: Control of camera operation in relation to power supply - H04N 23/698: for achieving an enlarged field of view, e.g. panoramic image capture - G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q) - G06T: IMAGE DATA PROCESSING OR GENERATION, IN GENERAL - H04N: PICTORIAL COMMUNICATION, e.g. TELEVISION ## Abstract A method and an apparatus are disclosed for detecting a structure to be applied to a substrate, such as an adhesive bead or a sealant track, with one or more optical acquisition apparatuses. The images from the optical acquisition apparatuses are combined to form a plan view such that a representation of the optical acquisition devices is output in a common image. The optical acquisition devices have, as a center, an application device for applying the structure to the substrate. ## Claims ### Claim at position 1 1-20. (canceled) ### Claim 21 A method for detecting a structure to be applied to a substrate, such as an adhesive bead or a sealant track, with a number of optical acquisition apparatuses comprising a number of image acquisition sensors, the method comprising: combining images of the optical acquisition apparatuses to form a plan view such that a representation of the optical acquisition devices is output in a common image such that in the common image of the optical acquisition devices, as a center, the position of an application device for applying the structure to the substrate is provided; and arranging the optical acquisition apparatuses around the application device within a sensor head, the optical acquisition apparatuses being connected within the sensor head to a device for assembling the overall image; wherein the images of the optical acquisition apparatuses are assembled to form a common image which is assembled from images in the form of disc segments of the optical acquisition apparatuses in order to produce a 360° view around the application unit. ### Claim 22 (depends on 21) The method of claim 21 wherein an image acquisition frequency is increased according to a reduction of data by only acquiring a defined section of the image of each optical acquisition apparatus. ### Claim 23 (depends on 22) The method of claim 22 wherein the optical acquisition apparatuses each have a CCD chip or CMOS chip. ### Claim 24 (depends on 21) The method of claim 21 wherein the optical acquisition apparatuses are connected within the sensor head to a device for trigger and flash control for illumination which is made in particular in a form of a plurality of flashed LEDs within the sensor head. ### Claim 25 (depends on 24) The method of claim 24 wherein the optical acquisition apparatuses, the device for trigger and flash control and the device for assembling the overall image are connected within the sensor head such that just one connection of the sensor head to an external processing device is provided for detecting and examining the structure to be applied. ### Claim 26 (depends on 23) The method of claim 23 wherein only approximately ¼ of image lines are used as strips of the image for each CCD chip or CMOS chip, and the image acquisition frequency is quadrupled. ### Claim 27 (depends on 21) The method of claim 21 wherein a paramaterization of an image sequence obtained from a reference application structure and which results from a single image acquisition run of all of the optical acquisition devices is automatically undertaken by a one-off external indication of the reference application structure and is used for comparison with an applied adhesive track. ### Claim 28 (depends on 21) The method of claim 21 wherein the images of the optical acquisition devices are used to examine the applied structure, the images of all of the optical acquisition devices together forming a disc around the application device. ### Claim 29 (depends on 21) The method of claim 21 wherein, according to a profile of the application structure, for monitoring there is an automatic switch from a disc segment of an optical acquisition device to another disc segment of an adjacent optical acquisition device if the application structure to be monitored runs from a disc segment of an optical acquisition device to another disc segment of the adjacent optical acquisition device. ### Claim 30 An apparatus for detecting a structure to be applied to a substrate, such as an adhesive bead or a sealant track, the apparatus comprising: a plurality of optical acquisition apparatuses comprising a number of image acquisition sensors, wherein images of the optical acquisition apparatuses are combined to form a plan view such that a representation of the optical acquisition devices is output in a common image; and an application device arranged between the optical acquisition devices in order to apply the structure to the substrate; wherein the optical acquisition apparatuses are arranged around the application device within a sensor head, the optical acquisition apparatuses respectively being connected within the sensor head to a device for assembling the overall image, and wherein the images of the optical acquisition apparatuses are assembled to form an overall image which is made up of images in the form of disc segments of the optical acquisition apparatus in order to produce a 360° view around the application unit. ### Claim 31 (depends on 30) The apparatus of claim 30 wherein an image acquisition frequency is increased according to a reduction of data due to the acquisition of just one defined section of the image of each optical acquisition apparatus ### Claim 32 (depends on 30) The apparatus of claim 30 wherein the optical acquisition apparatuses each have a CCD chip or CMOS chip. ### Claim 33 (depends on 30) The apparatus of claim 30 wherein the optical acquisition apparatuses are connected within the sensor head to a device for trigger and flash control for illumination which is made in particular in a form of a plurality of flashed LEDs in the sensor head. ### Claim 34 (depends on 33) The apparatus of claim 33 wherein the optical acquisition apparatuses, the device for trigger and flash control and the device for assembling the overall image are connected within the sensor head such that just one connection of the sensor head to an external processing device is provided for detecting and examining the structure to be applied. ### Claim 35 (depends on 32) The apparatus of claim 32 wherein only approximately ¼ of image lines are used as strips of the image for each CCD chip or CMOS chip, and the image acquisition frequency is quadrupled. ### Claim 36 (depends on 30) The apparatus of claim 30 wherein a parameterisation of an image sequence obtained from a reference application structure and which results from a single image acquisition run of all of the optical acquisition devices is automatically undertaken by a one-off external indication of the reference application structure and is used for comparison with an applied adhesive track. ### Claim 37 (depends on 30) The apparatus of claim 30 wherein the images of the optical acquisition devices are used to examine the applied structure, the images of all of the optical acquisition devices together forming a disc around the application device. ### Claim 38 (depends on 30) The apparatus of claim 30 wherein, according to a profile of the application structure, for monitoring there is an automatic switch from a disc segment of an optical acquisition device to another disc segment of an adjacent optical acquisition device if the application structure to be monitored runs from a disc segment of an optical acquisition device to another disc segment of the adjacent optical acquisition device.