# US 2015/0146899 A1 · Solderless hearing assistance device assembly and method > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2015/0146899 A1 - Document ID: US20150146899A1 - Status: Published application - Kind: A1 - Application number: 14/092,723 - Filed: 2013-11-27 - Published: 2015-05-28 - Earliest claimed: 2013-11-27 - Assignees: Starkey Laboratories, Inc. - Inventors: John Dzarnoski; Susie Krzmarzick; Douglas F. Link; David Prchal - Web page: https://patentgrep.com/patent/US20150146899A1 ## CPC - H04R 25/658: {Manufacture of housing parts} - H04R 25/609: {of circuitry (of electronic switches or control elements H04R25/603)} - H04R 31/00: Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor {(manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182)} - H01R 12/7076: {for connection between PCB and component, e.g. display} - H01R 12/714: {with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit} - H01R 13/2414: {conductive elastomers} - H01R 2201/12: for medicine and surgery - H04R 2225/023: Completely in the canal [CIC] hearing aids - H04R 2225/025: In the ear hearing aids [ITE] hearing aids - H04R 2225/49: Reducing the effects of electromagnetic noise on the functioning of hearing aids, by, e.g. shielding, signal processing adaptation, selective (de)activation of electronic parts in hearing aid - Y10T 29/49005: Acoustic transducer - H04R: LOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; ELECTRIC HEARING AIDS; PUBLIC ADDRESS SYSTEMS (producing sounds with frequency not determined by supply frequency G10K) - H01R: ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract Disclosed herein, among other things, are systems and methods for solderless assembly for hearing assistance devices. One aspect of the present subject matter includes a method of manufacturing a hearing assistance device. According to various embodiments, the method includes providing a molded interconnect device (MID) housing and inserting a flexible circuit module having conductive surface traces into the MID housing. One or more hearing assistance electronic modules are connected to the MID housing using direct compression without the use of wires or solder, according to various embodiments. In one embodiment, the MID housing includes a laser-direct structuring (LDS) housing. ## Claims ### Claim 1 A method of manufacturing a hearing assistance device, the method comprising: providing a molded interconnect device (MID) housing; inserting a flexible circuit module having conductive surface traces into the MID housing; and connecting one or more hearing assistance electronic modules to the MID housing using direct compression without the use of wires or solder. ### Claim 2 (depends on 1) The method of claim 1, wherein connecting the one or more hearing assistance electronic modules includes connecting a processing module. ### Claim 3 (depends on 2) The method of claim 2, wherein the processing module includes an integrated flex connection on an edge of the processing module, the integrated flex connection including exposed traces. ### Claim 4 (depends on 1) The method of claim 1, wherein connecting the one or more hearing assistance electronic modules includes connecting a microphone module. ### Claim 5 (depends on 4) The method of claim 4, wherein connecting the microphone module includes using a retention band to secure the connection. ### Claim 6 (depends on 5) The method of claim 5, wherein using a retention band includes using a heat shrink band of irradiated polymer. ### Claim 7 (depends on 5) The method of claim 5, wherein using a retention band includes using a metal clip. ### Claim 8 (depends on 4) The method of claim 4, wherein a microphone enclosure is configured to provide compression for the connection. ### Claim 9 (depends on 1) The method of claim 1, wherein connecting the one or more hearing assistance electronic modules includes making a program connection using cam pressure from a battery drawer. ### Claim 10 (depends on 9) The method of claim 9, wherein the one or more hearing assistance modules includes a microphone, and wherein the microphone is replaceable via the battery door. ### Claim 11 (depends on 1) The method of claim 1, wherein providing a molded interconnect device (MID) housing includes providing a laser-direct structuring (LDS) housing. ### Claim 12 (depends on 1) The method of claim 1, wherein connecting the one or more hearing assistance electronic modules includes connecting a receiver module using a MID receptacle connection. ### Claim 13 A hearing assistance device, comprising a molded interconnect device (MID) housing; a flexible circuit module having conductive surface traces, the flexible circuit module configured to be inserted into the MID housing; and one or more hearing assistance electronic modules configured to connect to the MID housing using direct compression without the use of wires or solder. ### Claim 14 (depends on 13) The device of claim 13, wherein the hearing assistance device includes a hearing aid. ### Claim 15 (depends on 14) The device of claim 14, wherein the hearing aid includes an in-the-ear (ITE) hearing aid. ### Claim 16 (depends on 14) The device of claim 14, wherein the hearing aid includes a behind-the-ear (BTE) hearing aid. ### Claim 17 (depends on 14) The device of claim 14, wherein the hearing aid includes an in-the-canal (ITC) hearing aid. ### Claim 18 (depends on 14) The device of claim 14, wherein the hearing aid includes a receiver-in-canal (RIC) hearing aid. ### Claim 19 (depends on 14) The device of claim 14, wherein the hearing aid includes a completely-in-the-canal (CIC) hearing aid. ### Claim 20 (depends on 14) The device of claim 14, wherein the hearing aid includes a receiver-in-the-ear (RITE) hearing aid. ### Claim 21 (depends on 14) The device of claim 14, wherein the hearing aid includes an invisible-in-canal (IIC) hearing aid. ### Claim 22 (depends on 13) The device of claim 13, wherein the molded interconnect device (MID) housing includes a laser-direct structuring (LDS) housing.