# US 2015/0145831 A1 · Proximity sensing device and method for manufacturing the same, and electronic device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2015/0145831 A1 - Document ID: US20150145831A1 - Status: Published application - Kind: A1 - Application number: 14/471,133 - Filed: 2014-08-28 - Published: 2015-05-28 - Earliest claimed: 2013-11-22 - Assignees: Sony Corporation - Applicants: Sony Corporation - Inventors: Kun LI; Wenhua LONG; Andy LIU - Web page: https://patentgrep.com/patent/US20150145831A1 ## CPC - G06F 3/0421: {by interrupting or reflecting a light beam, e.g. optical touch-screen} - G06F 2203/04103: Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices - G06F 2203/04108: Touchless 2D- digitiser, i.e. digitiser detecting the X/Y position of the input means, finger or stylus, also when it does not touch, but is proximate to the digitiser's interaction surface without distance measurement in the Z direction - Y10T 29/49826: Assembling or joining - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract The embodiments of the present invention provide a proximity sensing device and a method for manufacturing the same, and an electronic device. The proximity sensing device includes: a window; a signal transmitting element integrated at an inner side of the window, to transmit an optical signal to an outer side of the window; and a signal sensing element integrated at the inner side of the window and disposed side by side with the signal transmitting element, to sense an object at the outer side of the window by receiving the optical signal reflected by the object. Through the embodiments of the present invention, the gap between the signal transmitting element, the signal sensing element and the window needs not to be considered too much, the integration process becomes easily controllable, and the light leakage is greatly reduced. ## Claims ### Claim 1 A proximity sensing device, comprising: a window; a signal transmitting element, integrated at an inner side of the window, to transmit an optical signal to an outer side of the window; and a signal sensing element, integrated at the inner side of the window and disposed side by side with the signal transmitting element, to sense an object at the outer side of the window by receiving the optical signal reflected by the object. ### Claim 2 (depends on 1) The proximity sensing device according to claim 1, wherein pads are encapsulated on the surfaces of the signal transmitting element and the signal sensing element connected to the window, and the signal transmitting element and the signal sensing element are bonded on the inner surface of the window by using the pads. ### Claim 3 (depends on 1) The proximity sensing device according to claim 1, wherein the signal transmitting element and the signal sensing element have pins integrated to the window, respectively, and signal lines of the signal transmitting element and the signal sensing element are connected to the window via the pins. ### Claim 4 (depends on 3) The proximity sensing device according to claim 3, wherein the pins are welded to the surface of the window using an Anisotropic Conductive Film (ACF) bonding technology. ### Claim 5 (depends on 3) The proximity sensing device according to claim 3, wherein the window is integrated with a Sensor On Lens (SOL), and the signal lines of the signal transmitting element and the signal sensing element are connected to the SOL via the pins. ### Claim 6 (depends on 1) The proximity sensing device according to claim 1, further comprising: a printed circuit board, disposed at sides of the signal transmitting element and the signal sensing element opposite the window. ### Claim 7 (depends on 6) The proximity sensing device according to claim 6, wherein signal lines of the signal transmitting element and the signal sensing element are connected to the printed circuit board. ### Claim 8 (depends on 1) An electronic device, comprising the proximity sensing device according to claim 1. ### Claim 9 (depends on 2) An electronic device, comprising the proximity sensing device according to claim 2. ### Claim 10 (depends on 3) An electronic device, comprising the proximity sensing device according to claim 3. ### Claim 11 (depends on 4) An electronic device, comprising the proximity sensing device according to claim 4. ### Claim 12 (depends on 5) An electronic device, comprising the proximity sensing device according to claim 5. ### Claim 13 (depends on 6) An electronic device, comprising the proximity sensing device according to claim 6. ### Claim 14 (depends on 7) An electronic device, comprising the proximity sensing device according to claim 7. ### Claim 15 A method for manufacturing a proximity sensing device, comprising: disposing a window; integrating a signal transmitting element at an inner side of the window, the signal transmitting element transmitting an optical signal to an outer side of the window; and integrating a signal sensing element at the inner side of the window and disposing the signal sensing element side by side with the signal transmitting element, the signal sensing element sensing an object at the outer side of the window by receiving the optical signal reflected by the object. ### Claim 16 (depends on 15) The method for manufacturing a proximity sensing device according to claim 15, further comprising: encapsulating pads on the surfaces of the signal transmitting element and the signal sensing element connected to the window, and bonding the signal transmitting element and the signal sensing element on the inner surface of the window by using the pads. ### Claim 17 (depends on 15) The method for manufacturing a proximity sensing device according to claim 15, wherein the signal transmitting element and the signal sensing element have pins integrated to the window, respectively, and signal lines of the signal transmitting element and the signal sensing element are connected to the window via the pins. ### Claim 18 (depends on 17) The method for manufacturing a proximity sensing device according to claim 17, wherein the window is integrated with a Sensor On Lens (SOL), the method further comprising: welding the pins to the surface of the window using an Anisotropic Conductive Film (ACF) bonding technology, wherein the signal lines of the signal transmitting element and the signal sensing element are connected to the SOL via the pins.