# US 2015/0144591 A1 · Etching composition and method for producing printed-wiring board using the same

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- Number: US 2015/0144591 A1
- Document ID: US20150144591A1
- Status: Published application
- Kind: A1
- Application number: 14/542,913
- Filed: 2014-11-17
- Published: 2015-05-28
- Earliest claimed: 2013-11-22
- Assignees: Mitsubishi Gas Chemical Company, Inc.
- Applicants: Mitsubishi Gas Chemical Company, Inc.
- Inventors: Kenichi TAKAHASHI; Norifumi TASHIRO
- Web page: https://patentgrep.com/patent/US20150144591A1

## CPC

- C23F 1/18: for etching copper or alloys thereof
- H05K 3/067: {Etchants}
- C23F: NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE (working metal by laser beams B23K26/00; desurfacing by applying flames B23K7/00; working of metal by electro-erosion B23H; producing decorative effects by removing surface material, e.g. by engraving, by etching, B44C1/22; electrolytic etching or polishing C25F); INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

The present invention can provide an etching composition for a chemical copper plating for the production of a printed-wiring board according to a semi-additive process, which comprises 0.2 to 5% by mass of hydrogen peroxide, 0.5 to 10% by mass of sulfuric acid, 0.001 to 0.3% by mass of phenylurea, 0.1 to 3 mass ppm of halogen ion and 0.003 to 0.3% by mass of tetrazoles, and wherein the ratio of the dissolution rate of the chemical copper plating (Y) to the dissolution rate of an electrolytic copper plating (X) at a liquid temperature of 30° C. (Y/X) is 4 to 7.

## Claims

### Claim 1

An etching composition for a chemical copper plating for the production of a printed-wiring board according to a semi-additive process, which comprises 0.2 to 5% by mass of hydrogen peroxide, 0.5 to 10% by mass of sulfuric acid, 0.001 to 0.3% by mass of phenylurea, 0.1 to 3 mass ppm of halogen ion and 0.003 to 0.3% by mass of tetrazoles, and wherein the ratio of the dissolution rate of the chemical copper plating (Y) to the dissolution rate of an electrolytic copper plating (X) at a liquid temperature of 30° C. (Y/X) is 4 to 7.

### Claim 2 (depends on 1)

The etching composition according to claim 1, wherein the tetrazoles are at least one selected from the group consisting of 1-methyltetrazole, 1-methyl-5-ethyltetrazole, 1-ethyl-5-methyltetrazole, 1,5-dimethyltetrazole and 1,5-diethyltetrazole.

### Claim 3 (depends on 1)

The etching composition according to claim 1, which comprises 0.4 to 2.5% by mass of hydrogen peroxide, 0.8 to 6.0% by mass of sulfuric acid, 0.005 to 0.15% by mass of phenylurea, 0.3 to 2.5 mass ppm of halogen ion and 0.005 to 0.02% by mass of tetrazoles.

### Claim 4 (depends on 1)

The etching composition according to claim 1, wherein the dissolution rate of the electrolytic copper plating at a liquid temperature of 30° C. (X) is 0.1 to 0.8 μm/min. and the dissolution rate of the chemical copper plating at a liquid temperature of 30° C. (Y) is 1.5 to 2.8 μm/min.

### Claim 5

A method for producing a printed-wiring board, which comprises:
removing a chemical copper plating by etching using an etching composition, which comprises 0.2 to 5% by mass of hydrogen peroxide, 0.5 to 10% by mass of sulfuric acid, 0.001 to 0.3% by mass of phenylurea, 0.1 to 3 mass ppm of halogen ion and 0.003 to 0.3% by mass of tetrazoles, and wherein the ratio of the dissolution rate of the chemical copper plating (Y) to the dissolution rate of an electrolytic copper plating (X) at a liquid temperature of 30° C. (Y/X) is 4 to 7.

### Claim 6 (depends on 5)

The method for producing a printed-wiring board according to claim 5, wherein the tetrazoles are at least one selected from the group consisting of 1 -methyltetrazole, 1-methyl-5-ethyltetrazole, 1-ethyl-5-methyltetrazole, 1,5-dimethyltetrazole and 1,5-diethyltetrazole.

### Claim 7 (depends on 5)

The method for producing a printed-wiring board according to claim 5, wherein the etching composition comprises 0.4 to 2.5% by mass of hydrogen peroxide, 0.8 to 6.0% by mass of sulfuric acid, 0.005 to 0.15% by mass of phenylurea, 0.3 to 2.5 mass ppm of halogen ion and 0.005 to 0.02% by mass of tetrazoles.

### Claim 8 (depends on 5)

The method for producing a printed-wiring board according to claim 5, wherein the dissolution rate of the electrolytic copper plating at a liquid temperature of 30° C. (X) is 0.1 to 0.8 μm/min. and the dissolution rate of the chemical copper plating at a liquid temperature of 30° C. (Y) is 1.5 to 2.8 μm/min.