# US 2015/0143679 A1 · Method for manufacturing capacitor, and capacitor

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- Number: US 2015/0143679 A1
- Document ID: US20150143679A1
- Status: Published application
- Kind: A1
- Application number: 14/584,763
- Filed: 2014-12-29
- Published: 2015-05-28
- Earliest claimed: 2008-06-20
- Assignees: Fujitsu Limited
- Inventors: Yoshihiko IMANAKA
- Web page: https://patentgrep.com/patent/US20150143679A1

## CPC

- H01G 4/12: Ceramic dielectrics {(H01G4/085 takes precedence)}
- C23C 24/04: Impact or kinetic deposition of particles
- H01G 9/0029: {Processes of manufacture}
- H01G 9/04: Electrodes {or formation of dielectric layers thereon}
- H01G 9/045: based on aluminium
- H01G: CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE (selection of specified materials as dielectric H01B3/00; capacitors having potential barriers H10D1/62, H10K10/10)
- C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04)

## Abstract

A method for manufacturing a capacitor, includes: accelerating conductor particles by ejecting the conductor particles together with gas, each surface of the conductor particles covered with a dielectric entirety; fixing the conductor particles to a substrate with the surface of the conductor particles still covered with the dielectric entirely by colliding the conductor particles with the substrate; and sandwiching a deposited film formed of the conductor particles fixed to the substrate between electrodes.

## Claims

### Claim 1

A method for manufacturing a capacitor, comprising:
accelerating conductor particles by ejecting the conductor particles together with gas, each surface of the conductor particles covered with a dielectric entirely;
fixing the conductor particles to a substrate with the surface of the conductor particles still covered with the dielectric entirely by colliding the conductor particles with the substrate; and
sandwiching a deposited film formed of the conductor particles fixed to the substrate electrodes.

### Claim 2 (depends on 1)

The method for manufacturing a capacitor according to claim 1, wherein the ejecting the conductor particles includes ejecting dielectric particles together with the conductor particles, and the colliding the conductor particles includes colliding the dielectric particles with the substrate together with the conductor particles.

### Claim at position 3

3-8. (canceled)

### Claim 9

A method for manufacturing a capacitor, comprising:
applying a compressive stress to conductor particles, each surface of the conductor particles covered with a dielectric entirely, to fix the conductor particles to each other with the surface of the conductor particles stilt covered with the dielectric entirely and
sandwiching a structural body formed of the conductor particles fixed to each other, between electrodes.

### Claim at position 5

10-11. (canceled)