Embedded package security tamper mesh
AssigneeBroadcom Corporation
InventorsMark BUER, Matthew KAUFMANN
Life of this patent
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Abstract
A secure integrated circuit package is provided. The secure integrated circuit package includes a first substrate having an upper surface and a lower surface. A first plurality of solder balls are arranged in a pattern on the lower surface of the first substrate. A die is coupled to the upper surface of the first substrate. A second plurality of solder balls is coupled to the upper surface of the substrate and arranged in a ring surrounding the die. A mesh substrate including a mesh protection grid is coupled to the second plurality of solder balls.
Claims20
A secure integrated circuit package, comprising:
- a substrate including a plurality of outer contacts disposed on an upper surface of the substrate;
- a die coupled to the upper surface of the substrate;
- a mesh die coupled to an upper surface of the die, the mesh die including:
- a mesh protection grid, and
- a plurality of mesh die pads disposed in a ring on an upper surface of the mesh die;
- and
- a plurality of bond wires, wherein each bond wire from among the plurality of bond wires connects a mesh die pad from among the plurality of mesh die pads to a corresponding outer contact of the plurality of outer contacts to form a cage of bond wires surrounding the die.
A secure integrated circuit package, comprising:
- a substrate having an upper surface and a lower surface, wherein a first plurality of solder balls are arranged in a pattern on the lower surface of the substrate;
- a die coupled to the upper surface of the substrate;
- a second plurality of solder balls coupled to the upper surface of the substrate and arranged in a ring surrounding the die;
- and
- a mesh substrate, including a mesh protection grid, the mesh substrate coupled to the second plurality of solder balls.
A method to form a secure integrated circuit package, the method comprising:
- forming a first plurality of solder balls on a lower surface of a substrate;
- coupling a die to an upper surface of the substrate;
- forming a second plurality of solder balls in a ring surrounding the die on the upper surface the substrate;
- and
- coupling a mesh substrate, including a mesh protection grid, to the second plurality of solder balls.
Dependencies are inferred from the claim text.