# US 2015/0103498 A1 · Power module package and method of manufacturing the same

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- Number: US 2015/0103498 A1
- Document ID: US20150103498A1
- Status: Published application
- Kind: A1
- Application number: 14/513,456
- Filed: 2014-10-14
- Published: 2015-04-16
- Earliest claimed: 2013-10-15
- Assignees: Fairchild Korea Semiconductor Ltd.
- Applicants: Fairchild Korea Semiconductor Ltd.
- Inventors: Keunhyuk Lee; Oseob Jeon; Joon-seo Son; Seungwon Im
- Web page: https://patentgrep.com/patent/US20150103498A1

## CPC

- H10W 74/016: {using moulds}
- H05K 3/284: {for encapsulating mounted components (H05K1/185 takes precedence)}
- H10W 40/255: {having a laminate or multilayered structure, e.g. direct bond copper [DBC] ceramic substrates}
- H10W 70/658: {for devices provided for in groups H10D8/00 - H10D48/00}
- H10W 74/114: {by a substrate and the encapsulations}
- H10W 90/00: Package configurations
- H10W 90/10: Configurations of laterally-adjacent chips
- H10W 90/701: {characterised by the relative positions of pads or connectors relative to package parts}
- H05K 3/4015: {using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres}
- H05K 2201/10318: Surface mounted metallic pins
- H05K 2201/10333: Individual female type metallic connector elements
- H05K 2203/1316: Moulded encapsulation of mounted components
- H10W 72/073: {of die-attach connectors}
- H10W 72/07336: {Soldering or alloying}
- H10W 72/07337: {using a polymer adhesive, e.g. an adhesive based on silicone or epoxy}
- H10W 72/075: {of bond wires}
- H10W 72/076: {of strap connectors}
- H10W 72/07636: {Soldering or alloying}
- H10W 72/07653: {changes in shapes}
- H10W 72/20: Bump connectors, e.g. solder bumps or copper pillars; Dummy bumps; Thermal bumps
- H10W 72/30: Die-attach connectors
- H10W 72/325: {Die-attach connectors having a filler embedded in a matrix}
- H10W 72/352: {comprising metals or metalloids, e.g. solders}
- H10W 72/354: {comprising polymers}
- H10W 72/871: {Bond wires and strap connectors}
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 72/886: {Die-attach connectors and strap connectors}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/734: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/754: {between a chip and a stacked insulating package substrate, interposer or RDL}
- H10W 90/764: {between a chip and a stacked insulating package substrate, interposer or RDL}
- Y10T 29/49133: with component orienting
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION

## Abstract

Provided is a power module package including: a substrate; at least one electrode arranged on the substrate; and an encapsulation member covering at least a portion of the substrate, the encapsulation member including a housing unit housing the at least one electrode. The at least one electrode is spaced apart from the encapsulation member.

## Claims

### Claim 1

A power module package comprising:
a substrate;
at least one electrode arranged on the substrate; and
an encapsulation member covering at least a portion of the substrate, the encapsulation member comprising a housing unit housing the at least one electrode,
wherein the at least one electrode is spaced apart from and not contacted by the encapsulation member.

### Claim 2 (depends on 1)

The power module package of claim 1, wherein the housing unit has a closed cross-section arranged in a first direction perpendicular to an upper surface of the substrate.

### Claim 3 (depends on 1)

The power module package of claim 1, wherein the housing unit has an open cross-section arranged in a first direction perpendicular to an upper surface of the substrate.

### Claim 4 (depends on 1)

The power module package of claim 1, wherein the housing unit houses two or more electrodes.

### Claim 5 (depends on 1)

The power module package of claim 1, wherein the at least one electrode has an exposed upper surface and an exposed side extending above an upper surface of the encapsulation member.

### Claim 6 (depends on 1)

The power module package of claim 1, wherein an upper surface of the at least one electrode is disposed higher than an upper surface of the encapsulation member relative to an upper surface of the substrate.

### Claim 7 (depends on 1)

The power module package of claim 1, wherein the at least one electrode has a pillar shape.

### Claim 8 (depends on 7)

The power module package of claim 7, wherein the at least one electrode has a cross-sectional area in a first direction perpendicular to an upper surface of the substrate, and the cross-sectional area is constant or varies according to the first direction.

### Claim 9 (depends on 1)

The power module package of claim 1, wherein the at least one electrode comprises a socket member contacting the substrate and having a hole in which an external pin member is removably arranged.

### Claim 10 (depends on 9)

The power module package of claim 9, wherein the socket member comprises:
a base unit contacting an upper surface of the substrate; and
a body unit extending from the base unit in a first direction perpendicular to the upper surface of the substrate, the body unit including the hole.

### Claim 11 (depends on 9)

The power module package of claim 9, wherein the at least one electrode further comprises a pin member connected to the socket member,
wherein the pin member extends in a first direction perpendicular to an upper surface of the substrate, and a top surface of the pin member has a level higher than that of an upper surface of the socket member.

### Claim 12 (depends on 1)

The power module package of claim 1, wherein the substrate comprises:
an insulation body;
an upper conductive pattern formed on an upper surface of the insulation body; and
a lower conductive pattern formed on a lower surface of the insulation body,
wherein the at least one electrode is disposed on a portion of the upper conductive pattern.

### Claim 13 (depends on 12)

The power module package of claim 12, wherein the housing unit exposes a portion of the upper conductive pattern or a portion of the insulation body.

### Claim 14 (depends on 1)

The power module package of claim 1, further comprising:
at least one semiconductor chip arranged on the substrate; and
a wiring member electrically connecting the at least one semiconductor chip and the at least one electrode,
wherein the at least one semiconductor chip and the wiring member is covered by the encapsulation member.

### Claim 15

A method of manufacturing a power module package, the method comprising:
arranging at least one semiconductor chip on a substrate;
arranging at least one electrode on the substrate;
forming a wiring member electrically connecting the at least one semiconductor chip and the at least one electrode;
mounting the substrate on a bottom mold die and connecting on the bottom mold die to a top mold die, the top mold die comprising a first part and a second part, the first part defining a first space where the at least one semiconductor chip and the wiring member is housed, and the second part defining a second space where the at least one electrode is housed; and
injecting an encapsulation material into the first space to cover at least a portion of the substrate, the at least one semiconductor chip, and the wiring member.

### Claim 16 (depends on 15)

The method of claim 15, wherein the injecting of the encapsulation material comprises injecting the encapsulation material into the first space and not into the second space.

### Claim 17 (depends on 15)

The method of claim 15, wherein the second part is spaced apart from the at least one electrode.

### Claim 18 (depends on 15)

The method of claim 15, wherein the second part has a depth greater than that of the first part relative to an upper surface of the substrate.

### Claim 19

A power module package, comprising:
a substrate;
an electrode arranged on the substrate; and
an encapsulation member encapsulating a portion of the substrate and encapsulating a portion of the electrode;
wherein the electrode does not contact the encapsulation member and wherein the electrode has an upper surface and a portion of a side extending above the encapsulation member.

### Claim 20 (depends on 19)

The power module package of claim 19, wherein the upper surface of the electrode is disposed higher than an upper surface of the encapsulation member relative to an upper surface of the substrate.