# US 2015/0103036 A1 · In-cell touch device and manufacturing method thereof > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 2015/0103036 A1 - Document ID: US20150103036A1 - Status: Published application - Kind: A1 - Application number: 14/349,869 - Filed: 2013-12-13 - Published: 2015-04-16 - Earliest claimed: 2013-05-31 - Assignees: Boe Technology Group Co., Ltd.; Chengdu Boe Optoelectronics Technology Co., Ltd. - Applicants: BOE Technology Group Co., Ltd.; Chengdu BOE Optoelectronics Technology Co., Ltd. - Inventors: Xiangdan Dong; Young Yik Ko; Minghua Xuan; Weiyun Huang; Yue Long - Web page: https://patentgrep.com/patent/US20150103036A1 ## CPC - G06F 3/0412: {Digitisers structurally integrated in a display} - G06F 3/041: Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means - G06F 3/04164: {Connections between sensors and controllers, e.g. routing lines between electrodes and connection pads} - H10D 86/021: {of multiple TFTs} - G06F 2203/04103: Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices - G06F: ELECTRIC DIGITAL DATA PROCESSING (computer systems based on specific computational models G06N) - H10D: INORGANIC ELECTRIC SEMICONDUCTOR DEVICES ## Abstract The present invention provides an in-cell touch device and a manufacturing method thereof. The in-cell touch device comprises: a color filter substrate, an array substrate, and an integration circuit, wherein conductive pads are arranged at the edges of each line and each column of the sensors in the sensor pattern on the color filter substrate, and conductive pads are arranged on the array substrate at the positions corresponding to the color filter substrate, wherein the conductive pads are formed in the transparent conductive layer, the conductive pads arranged on the color filter substrate are connected to the pads arranged at the corresponding positions on the array substrate with conductive guiding material, and the conductive pads arranged on the array substrate are connected to the integration circuit with metal wires, and wherein, the sensors communicate signals with the integration circuit in turns through the conductive pads arranged on the color filter substrate, the conductive guiding material, the conductive pads arranged on the array substrate, and the metal wires. It may effectively reduce the transmission resistance during the signal transmission by adopting technical solution provided in the present disclosure. ## Claims ### Claim at position 1 1-10. (canceled) ### Claim 11 An in-cell touch device, comprising: a color filter substrate, an array substrate, and an integration circuit, wherein conductive pads are arranged on edges of each line and each column of the sensors in the sensor pattern on the color filter substrate, and conductive pads are arranged on the array substrate at the positions corresponding to those conductive pads on the color filter substrate, wherein the conductive pads are formed in the transparent conductive layers of the color filter substrate and the array substrate, the conductive pads arranged on the color filter substrate are connected to the conductive pads at the corresponding positions on the array substrate through conductive guiding material, and the conductive pads arranged on the array substrate are connected to the integration circuit by metal wires, and wherein the sensors are used for communicating signals with the integrate circuit in turns through the conductive pads arranged on the color filter substrate, the conductive guiding material, the conductive pads arranged on the array substrate, and the metal wires. ### Claim 12 (depends on 11) The in-cell touch device according to claim 11, wherein the conductive pads are arranged at both the left and right edges of each line of the sensors in the sensor pattern on the color filter substrate. ### Claim 13 (depends on 11) The in-cell touch device according to claim 11, wherein the integration circuit is bound on the array substrate. ### Claim 14 (depends on 12) The in-cell touch device according to claim 12, wherein the integration circuit is bound on the array substrate. ### Claim 15 (depends on 11) The in-cell touch device according to claim 11, wherein the metal wires are the metal wires formed from the metal layer on the array substrate. ### Claim 16 (depends on 12) The in-cell touch device according to claim 12, wherein the metal wires are the metal wires formed from the metal layer on the array substrate. ### Claim 17 (depends on 13) The in-cell touch device according to claim 13, wherein the metal wires are the metal wires formed from the metal layer on the array substrate. ### Claim 18 (depends on 14) The in-cell touch device according to of claim 14, wherein the metal wires are the metal wires formed from the metal layer on the array substrate. ### Claim 19 (depends on 15) The in-cell touch device according to claim 15, wherein the material of the metal layer is selected from Mo, Al, AiNd, or AlNdMo. ### Claim 20 A method for manufacturing an in-cell touch device comprising: arranging conductive pads on edges of each line and each column of the sensors in the sensor pattern on a color filter substrate, and arranging conductive pads on an array substrate at the positions corresponding to those conductive pads on the color filter substrate, the conductive pads being formed in transparent conductive layers of the color filter substrate and the array substrate; connecting the conductive pads arranged on the color filter substrate and the conductive pads arranged at the corresponding positions on the array substrate with conductive guiding material, and connecting the conductive pads arranged on the array substrate and the integration circuit with metal wires, and communicating signals from the sensors to the integration circuit in turns through the conductive pads arranged on the color filter substrate, the conductive guiding material, the conductive pads arranged on the array substrate, and the metal material. ### Claim 21 (depends on 20) The method according to claim 20, wherein the arranging the conductive pads at the edges of each line and each column of the sensors in the sensor pattern on the color filter substrate comprises: arranging the conductive pads at both left and right edges of the each line of the sensors in the sensor pattern on the color filter substrate. ### Claim 22 (depends on 20) The method according to claim 20, wherein the method further comprises: determining the positions of the arranged conductive pads based on the dimensions of the panels and the sizes of the frames formed by the color filter substrate and the array substrates when arranging the conductive pads on the color filter substrate. ### Claim 23 (depends on 21) The method according to claim 21, wherein the method further comprises: determining the positions of the arranged conductive pads based on the dimensions of the panels and the sizes of the frames formed by the color filter substrate and the array substrates when arranging the conductive pads on the color filter substrate. ### Claim 24 (depends on 20) The method according to claim 20, wherein the metal wires are the metal wires formed from the metal layer on the array substrate. ### Claim 25 (depends on 21) The method according to claim 21, wherein the metal wires are the metal wires formed from the metal layer on the array substrate. ### Claim 26 (depends on 22) The method according to claim 22, wherein the metal wires are the metal wires formed from the metal layer on the array substrate. ### Claim 27 (depends on 23) The method according to claim 23, wherein the metal wires are the metal wires formed from the metal layer on the array substrate. ### Claim 28 (depends on 24) The method according to claim 24, wherein the material of the metal layer is selected from Mo, Al, AlNd or AlNdMo.