# US 2015/0102264 A1 · Electrically Conductive Polyamide-imide Solution for the Purpose of Creating Electrical Circuits.

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 2015/0102264 A1
- Document ID: US20150102264A1
- Status: Published application
- Kind: A1
- Application number: 13/956,380
- Filed: 2013-10-11
- Published: 2015-04-16
- Earliest claimed: 2013-10-11
- Inventors: Ryan David Allmandinger; Donald David Allmandinger
- Web page: https://patentgrep.com/patent/US20150102264A1

## CPC

- H05K 1/095: {for polymer thick films, i.e. having a permanent organic polymeric binder}
- C09D 5/24: Electrically-conducting paints {(conductive materials H01B1/00)}
- H01B 1/22: the conductive material comprising metals or alloys
- H01B 1/24: the conductive material comprising carbon-silicon compounds, carbon or silicon
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- C09D: COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR (cosmetics A61K; processes for applying liquids or other fluent materials to surfaces, in general, B05D; staining wood B27K5/02; glazes or vitreous enamels C03C; natural resins, French polish, drying-oils, driers, turpentine, per se, C09F; polishing compositions other than French polish, ski waxes C09G; adhesives or use of materials as adhesives C09J; materials for sealing or packing joints or covers C09K3/10; materials for stopping leaks C09K3/12; processes for the electrolytic or electrophoretic production of coatings C25D)
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})

## Abstract

This is the development of a new conductive ink utilizing modern plastics and processes for the purpose of improving modern circuitry. By dissolving polyamide-imide (PAI) resin and mixing it with a conductive material (such as carbon, silver, copper, or gold) we can create an electrically conductive ink that can be printed into circuitry. This method of circuit printing is far stronger and resistant to environmental forces.

## Claims

### Claim 1

An electrically conductive mixture consisting of liquefied polyamide-imide solution serving as a carrier for any conductive material for the purpose of creating an electric circuit.