Mounting solution for components on a very fine pitch array
AssigneeAlcatel-Lucent Canada Inc.
InventorsAlex CHAN, Paul J. BROWN
Life of this patent
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Abstract
Various exemplary embodiments relate to a printed circuit board (PCB) comprising a ball grid array (BGA) of BGA pads on one side of the PCB, arranged in a grid pattern; through-hole vias, including a via pad, arranged in said grid pattern electrically connected to said BGA pads; a solder mask covering the via pad with an opening; a solder pad within said opening electrically connected to said via pad; and a two-lead component attached to said solder pad.
Claims18
A printed circuit board (PCB) comprising:
- a ball grid array (BGA) of BGA pads on one side of the PCB, arranged in a grid pattern;
- through-hole vias, including a via pad, arranged in said grid pattern electrically connected to said BGA pads;
- a solder mask covering the via pad with an opening;
- a solder pad within said opening electrically connected to said via pad;
- and
- a two-lead component attached to said solder pad.
A method of manufacturing a PCB comprising the steps of:
- selecting two adjacent through-hole vias on a printed circuit board (PCB),
- wherein each via has a corresponding via pad, and
- wherein the PCB has a ball grid array (BGA) of BGA pads on one side of the PCB arranged in a grid pattern;
- covering each via with a respective solder mask;
- removing areas from said solder masks,
- wherein the areas overlap the holes of the respective through-hole vias;
- placing solder pads in said areas;
- and
- attaching a two-lead component to said two adjacent through-hole vias using said solder pads.
A computer aided design tool implemented on a computing device for accommodating a two-lead component on in a 0.65 mm by 0.65 mm pitch ball grid array (BGA) printed circuit board (PCB) comprising:
- a design tool mode configured to select two adjacent through-hole vias on the printed circuit board (PCB) for connection to a two-lead component
- a design tool mode configured to identify a placement of solder pads and shape of solder pads on the two adjacent through-hole vias,
- wherein the placement allows a two-lead component to connect to two adjacent through-hole vias, and
- wherein the solder pads overlap the holes of the respective through-hole vias.
Dependencies are inferred from the claim text.