Devices and stacked microelectronic packages with parallel conductors and intra-conductor isolator structures and methods of their fabrication

A stacked microelectronic package, comprising:

• a first microelectronic package having a first package sidewall, an embedded first microelectronic device, and a first device-to-edge conductor between the first microelectronic device and the first package sidewall, wherein an end of the first device-to-edge conductor that is exposed at the first package sidewall defines a first sidewall pad;
• a second microelectronic package vertically stacked on the first microelectronic package and having a second package sidewall, an embedded second microelectronic device, and a second device-to-edge conductor between the second microelectronic device and the second package sidewall, wherein an end of the second device-to-edge conductor that is exposed at the second package sidewall defines a second sidewall pad;
• a first sidewall conductor coupled to the first and second package sidewalls and having a first elongated portion, wherein the first sidewall conductor extends between and electrically couples the first and second sidewall pads;
• a second sidewall conductor coupled to either or both of the first and second package sidewalls and having a second elongated portion, wherein the first and second elongated portions are parallel with and adjacent to each other, and wherein the second sidewall conductor extends between and electrically couples third and fourth sidewall pads;
• and
• a first intra-conductor insulating structure coupled between the first and second sidewall conductors along an entirety of the first and second elongated portions of the first and second sidewall conductors, wherein the first intra-conductor insulating structure is configured to electrically insulate the first and second elongated portions of the first and second sidewall conductors from each other.

A method comprising:

• coupling a first package surface conductor to a package surface, wherein the first package surface conductor has a first elongated portion, and the first package surface conductor extends between and electrically couples a first set of pads that are exposed at the package surface;
• coupling a second package surface conductor to the package surface, wherein the second package surface conductor has a second elongated portion, the first and second elongated portions are parallel with and adjacent to each other, and the second package surface conductor extends between and electrically couples a second set of pads that are exposed at the package surface;
• and
• coupling a intra-conductor insulating structure between the first and second package surface conductors along an entirety of the first and second elongated portions of the first and second package surface conductors, wherein the intra-conductor insulating structure is configured to electrically insulate the first and second elongated portions of the first and second package surface conductors from each other.