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US 2015/0092358 A1Published application
Package carrier
AssigneeSubtron Technology Co., Ltd.
InventorsChin-Sheng Wang, Ching-Sheng Chen, Chao-Min Wang
Life of this patent
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Abstract
A package carrier including a removable supporting plate and a circuit board is provided. The removable supporting plate includes a dielectric layer, a copper foil layer and a releasing layer. The dielectric layer is disposed between the copper foil layer and the releasing layer. The circuit board is disposed on the removable supporting plate and directly contacts the releasing layer. A thickness of the circuit board is between 30 μm and 100 μm.
Claims10
A package barrier, comprising:
- a removable supporting plate comprising a dielectric layer, a copper foil layer and a releasing layer, wherein the dielectric layer is disposed between the copper foil layer and the releasing layer;
- and
- a circuit board disposed on the removable supporting plate and directly contacting the releasing layer, wherein a thickness of the circuit board is between 30 μm to 100 μm.
Dependencies are inferred from the claim text.