Heat-conductive connection arrangement
AssigneeRobert Bosch GmbH
InventorsFrank Mayer, Juergen Jerg
Life of this patent
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Abstract
A heat-conductive connection arrangement for connecting a printed circuit board to a cooling body. The connection arrangement has a carrier which is flat. At least part of the carrier includes at least one balloon body which faces away from the carrier and is connected to the carrier. The balloon body includes an envelope which encloses an interior, and the interior is at least in part filled with a preferably free-flowing, in particular viscous, heat-conducting substance. The envelope is configured so as to tear open under the influence of pressure and to thus release the heat-conducting substance.
Claims11
A heat-conductive connection means (30, 31) for connecting a printed circuit board (3) to a cooling body (5), having a carrier (7) which is configured so as to be flat, wherein at least part of the carrier (7) includes at least one balloon body (8, 12) which faces away from the carrier (7) and is connected to the carrier (7), wherein the balloon body (8, 12) includes an envelope (9) which encloses an interior, wherein the interior is at least in part filled with a viscous heat-conducting means (10) and the envelope (9) is configured so as to tear open under the influence of pressure and to thus release the heat-conducting means (10).
A method for connecting a printed circuit board (3) or an electronic component (2) to a cooling body (5) in a heat-conducting manner, in which a connection means (30, 31) having at least one carrier (7) and at least one balloon body (8, 12) filled with a viscous heat-conducting means (10) is disposed between the cooling body (5) and the printed circuit board (3) or the electronic component (2), respectively, and the printed circuit board (3) or the component (2), respectively, are pressed onto the cooling body (5) in such a manner that an envelope (9) of the balloon body (8, 12) tears open and releases the heat-conducting means (10), and the heat-conducting means (10) produces a heat-conducting connection between the cooling body (5) and the printed circuit board (3) or the component (2).
Dependencies are inferred from the claim text.