Implementing redundant and high efficiency hybrid liquid and air cooling for chipstacks
AssigneeInternational Business Machines Corporation
InventorsBret P. Elison, Phillip V. Mann, Arden L. Moore, Arvind K. Sinha
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Abstract
A method and apparatus are provided for implementing redundant and high efficiency hybrid liquid and air cooling for chipstacks. The apparatus includes an electronic module having a chipstack of one or more semiconductor chips; a liquid heat sink lid over the chipstack; an inlet flow and an outlet flow enabling a low viscosity dielectric liquid to pass through the lid and around the chipstack of the electronic module; a top of said electronic module providing an airflow heat sink support surface for airflow cooling used in parallel to under-lid liquid cooling.
Claims16
An apparatus for implementing redundant and high efficiency hybrid liquid and air cooling for chipstacks comprising:
- an electronic module having a chipstack of one or more semiconductor chips;
- said electronic module having a liquid heat sink lid extending over the chipstack;
- said liquid heat sink lid having a liquid flow inlet and a liquid flow outlet enabling a low viscosity dielectric liquid to pass through said liquid heat sink lid and around the chipstack for under-lid liquid cooling;
- and
- a top of said electronic module providing an airflow heat sink support surface for airflow cooling used in parallel to underlid liquid cooling.
A method for implementing redundant and high efficiency hybrid liquid and air cooling for chipstacks comprising:
- providing an electronic module having a chipstack of one or more semiconductor chips;
- providing said electronic module having a liquid heat sink lid extending over the chipstack;
- providing said liquid heat sink lid having a liquid flow inlet and a liquid flow outlet enabling a low viscosity dielectric liquid to pass through said liquid heat sink lid and around the chipstack of the electronic module;
- and
- providing an airflow heat sink support surface for airflow cooling used in parallel to under-lid liquid cooling with a top of said electronic module.
Dependencies are inferred from the claim text.