Electronic component case and electronic component device

An electronic component case, comprising:

• a lower case including
• a bottom plate,
• a side wall,
• an engaging projection formed on an outer face of the side wall, and
• a substrate positioning projection formed on a periphery of a face of the bottom plate of the side wall side;
• and
• an upper case including
• a top plate,
• a side wall in which an engaging hole is formed, and
• a substrate pushing projection formed on a periphery of a face of the top plate of the side wall side, and corresponding to the substrate positioning projection of the lower case, wherein
• when an electronic component is to be housed between the lower case and the upper case, the substrate positioning projection of the lower case is inserted in a datum hole of a substrate of the electronic component, and a part of the substrate of the electronic component in a periphery of the datum hole is pushed by the substrate pushing projection of the upper case, and
• the engaging projection of the lower case is engaged to the engaging hole of the upper case.

An electronic component device, comprising:

• a lower case including
• a bottom plate,
• a side wall having a protruding portion,
• an engaging projection formed on an outer face of the side wall, and
• a screw hole formed in the side wall in a region where the protruding portion is provided;
• an upper case including
• a top plate,
• a side wall in which an engaging hole is formed, and
• a notched hole formed in the side wall on the top plate side;
• and
• an electronic component housed between the lower case and the upper case, wherein
• the protruding portion of the lower case is engaged to the notched hole of the upper case, and the screw hole is exposed in the notched hole, and
• the engaging projection of the lower case is engaged to the engaging hole of the upper case.

electronic component device, comprising:

• a lower case including
• a bottom plate,
• a side wall,
• an engaging projection formed on an outer face of the side wall, and
• a substrate positioning projection formed on a periphery of a face of the bottom plate of the side wall side,
• an upper case including
• a top plate,
• a side wall in which an engaging hole is formed, and
• a substrata pushing project ion formed on a periphery of a face of the top plate of this side wall side, and corresponding to the substrate positioning projection of the lower case;
• and
• an electronic component housed between the lower case and the upper case, wherein
• when the elect tonic component is housed between the lower case and the upper case, the substrate positioning projection of the lower case is inserted in a datum hole of a substrate of the electronic component, and a part of the substrate of the electronic component in a periphery of the datum hole is pushed by the substrate pushing projection of the upper case, and
• the engaging projection of the lower case is engaged to the engaging hole of the upper case.