Optical filter device, optical module, electronic device, and mems device

An optical module comprising:

• an interference filter that includes a first reflective film and a second reflective film facing the first reflective film;
• a housing that stores the interference filter;
• a bonding member that fixes the interference filter to the housing;
• and
• a detection unit that detects light extracted by the interference filter,
• wherein the housing includes a first surface which is located so as to face one surface of the interference filter, a second surface which is continuous with the first surface, the second surface is located so as to face another surface intersecting the one surface of the interference filter, and a third surface which is continuous from the first surface, the third surface is located in a direction away from the interference filter, and
• the bonding member is disposed between the one surface and the first surface, and between the another surface and the second surface.

An electronic device comprising:

• an interference filter that includes a first reflective film and a second reflective film facing the first reflective film;
• a housing that stores the interference filter;
• a bonding member that fixes the interference filter to the housing;
• and
• a control unit that controls the interference filter,
• wherein the housing includes a first surface which is located so as to face one surface of the interference filter, a second surface which is continuous with the first surface, the second surface is located so as to face another surface intersecting the one surface of the interference filter, and a third surface which is continuous from the first surface, the third surface is located in a direction away from the interference filter, and
• the bonding member is disposed between the one surface and the first surface, and between the another surface and the second surface.

A MEMS device comprising:

• a MEMS element;
• a housing that stores the MEMS element;
• and
• a bonding member that fixes the substrate to the housing,
• wherein the housing includes a first surface which is located so as to face one surface of the MEMS element, a second surface which is continuous with the first surface, the second surface is located so as to face another surface intersecting the one surface of the MEMS element, and a third surface which is continuous from the first surface, the third surface is located in a direction away from the MEMS element, and
• the bonding member is disposed between the one surface and the first surface, and between the another surface and the second surface.