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US 2015/0092201 A1Published application
Metrology tool for electroless copper thickness measurement for bbul process development monitoring
AssigneeIntel Corporation
InventorsNilanjan Ghosh, Zhiyong Wang, Yu-Chun Chen, Shuhong Liu
Life of this patent
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Abstract
A method including measuring a first distance to a surface of an integrated circuit substrate or a portion of an integrated circuit package by measuring an angle to it from two known points; introducing a material onto the surface; measuring a second distance to a surface of the film from the two known points; and determining a thickness of the introduced material by subtracting the second distance from the first distance.
Claims20
A method comprising:
- measuring a first distance to a surface of an integrated circuit substrate or a portion of an integrated circuit package by measuring an angle to it from two known points;
- introducing a material onto the surface;
- measuring a second distance to a surface of the film from the two known points;
- and
- determining a thickness of the introduced material by subtracting the second distance from the first distance.
2 more elements
A method comprising:
- transmitting light from a first fixed point to a surface of an integrated circuit substrate or a portion of an integrated circuit package;
- detecting a reflection of the transmitter light at a second point;
- measuring a reflection angle of the transmitted light between the first point and the second point;
- determining a first distance between the first point and the surface;
- introducing a material onto the surface;
- transmitting light from the first position to the surface of the introduced material;
- measuring a reflection angle of the transmitted light from the surface of the introduced material between the first point and the second point;
- determining a second distance between the first position and the surface of the introduced material;
- and
- determining a thickness of the introduced material by subtracting the second distance from the first distance.
7 more elements
A method comprising:
- introducing a dielectric film as a build-up layer on a package panel;
- transmitting light from a first fixed point to a surface of the dielectric film;
- measuring a reflection angle of the transmitted light between the first point and a second detection point;
- determining a first distance between the first point and the surface;
- introducing a material onto the surface;
- transmitting light from the first point to the surface of the introduced material;
- measuring a reflection angle of the transmitted light from the surface of the introduced material between the first point and the second point;
- determining a second distance between the first point and the surface of the introduced material;
- and
- determining a thickness of the introduced material by subtracting the second distance from the first distance.
7 more elements
Dependencies are inferred from the claim text.