Energy-harvesting device and method of forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsTien-Kan CHUNG, Wen-Chuan TAI, Yao-Te HUANG, Hsin-Ting HUANG, Shang-Ying TSAI, Chang-Yi YANG, Chia-Ming HUNG
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Abstract
A method of fabricating a device includes forming a moveable plate over a substrate. The method further includes forming an energy harvesting coil in the moveable plate. The method further includes forming at least one connector connecting the movable plate with the substrate, wherein a portion of the energy harvesting coil extends along the at least one connector. The method further includes enclosing the movable plate using a capping wafer.
Claims20
A method of fabricating a device, the method comprising:
- forming a moveable plate over a substrate;
- forming an energy harvesting coil in the moveable plate;
- forming at least one connector connecting the movable plate with the substrate, wherein a portion of the energy harvesting coil extends along the at least one connector;
- and
- enclosing the movable plate using a capping wafer.
The method of claim 5, further comprising forming at least one of the controller or the signal processing electronics on the substrate.
A device comprising:
- a wafer bonded to a substrate, the wafer comprising a movable plate;
- an energy harvesting coil in the moveable plate;
- at least one connector connecting the movable plate with the substrate, wherein a portion of the energy harvesting coil extends along the at least one connector;
- and
- a capping wafer enclosing the moveable plate.
A sensor system comprising:
- a micro-electromechanical system (MEMS) sensor, the MEMS sensor comprising:
- a wafer bonded to a substrate, the wafer comprising a movable plate;
- an energy harvesting coil in the moveable plate;
- at least one connector connecting the movable plate with the substrate, wherein a portion of the energy harvesting coil extends along the at least one connector;
- a controller electrically connected to the MEMS sensor;
- and
- signal processing electronics electrically connected to the controller, wherein the controller is configured to receive energy from the MEMS sensor and provide at least a portion of the received energy to the signal processing electronics.
Dependencies are inferred from the claim text.