Mold locks for laminate substrates
OwnerThomas H. Koschmiederinventor
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Abstract
A mechanism is provided by which delamination of a substrate of a system-in-package is prevented. A mold lock feature is provided within the substrate that allows the mold compound forming the encapsulant to flow into the mold lock feature, thereby anchoring the encapsulant to the substrate. The mold lock features can be provided in areas of the substrate where higher stresses due to component configuration are predicted. Aspects of the present invention provide for a method of forming the mold lock features that is compatible with current methods of forming laminate substrates, and thereby do not require an increase in cost for manufacturing the substrate.
Claims20
A semiconductor device package comprising:
- a substrate comprising
- a first layer having a first opening formed with a first opening area,
- a second layer having a second opening formed with a second opening area,
- wherein
- the second opening area is less than the first opening area,
- the second layer is provided above the first layer in a laminate stack forming the substrate,
- the second opening is located in a position that provides access to the first opening from a major surface of the substrate, and
- a third layer provided below the first layer in the laminate stack forming the substrate and covering the side of the first opening opposite the second layer;
- and
- encapsulant formed over the major surface of the substrate and within the first and second openings.
A method for forming a semiconductor device package comprising:
- forming a first opening in a first layer of a substrate;
- forming a second opening in a second layer of the substrate, wherein
- the first opening comprises a first opening area,
- the second opening comprises a second opening area,
- the second opening area is less than the first opening area;
- forming the substrate comprising the first and second layers and a third layer of the substrate, wherein
- the second opening is located in a position that provides access to the first opening from a major surface of the substrate, and
- the third layer is provided below the first layer in a laminate stack forming the substrate and covering the side of the first opening opposite the second layer;
- and
- forming an encapsulant over the major surface of the substrate and within the first and second openings.
Dependencies are inferred from the claim text.