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US 2015/0091195 A1Published application
Method of Packaging a Die
AssigneeInfineon Technologies AG
InventorChee Chian Lim
Life of this patent
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Abstract
A method of attaching a die to a substrate is disclosed. A major surface of the die has an array of electrical contacts, and is covered with a tape segment having an array of apertures in register with the contacts. Solder balls are inserted into the apertures. The die is positioned against a substrate with the solder balls in register with the die pads on the surface of the substrate, and a heat treatment process is performed to bond the conductive elements to the corresponding bond pads.
Claims1
A system comprising:
- a die comprising a plurality of electrical contacts;
- a substrate having a plurality of bond pads;
- a tape segment sandwiched between the die and the substrate, wherein the tape segment comprises an adhesive layer and a plurality of apertures, wherein the tape segment is directly disposed on the die;
- and
- a plurality of conductive elements disposed in the plurality of apertures, each conductive element being respectively bonded to a corresponding one of the plurality of electrical contacts and the plurality of bond pads.
2 more elements
Dependencies are inferred from the claim text.