Semiconductor Bonding Structures and Methods
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMeng-Tse Chen, Hsiu-Jen Lin, Wei-Hung Lin, Kuei-Wei Huang, Ming-Da Cheng, Chung-Shi Liu
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Abstract
A system and method for applying an underfill is provided. An embodiment comprises applying an underfill to a substrate and patterning the underfill. Once patterned other semiconductor devices, such as semiconductor dies or semiconductor packages may then be attached to the substrate through the underfill, with electrical connections from the other semiconductor devices extending into the pattern of the underfill.
Claims21
A method of manufacturing a device, the method comprising:
- applying an underfill material to a substrate;
- patterning the underfill material;
- and
- bonding a first semiconductor device to the substrate, at least a portion of the first semiconductor device extending through the underfill material.
A method of manufacturing a device, the method comprising:
- applying an underfill material onto a substrate;
- forming a first plurality of openings into the underfill material to expose a first portion of the substrate;
- and
- after the forming the first plurality of openings, placing a first electrical contact through one of the first plurality of openings.
15-20. (canceled)
A method of manufacturing a device, the method comprising:
- applying an underfill material to a first substrate;
- forming first openings through the underfill material to expose portions of the first substrate through the underfill material;
- aligning contacts located on a second substrate with the first openings;
- contacting the contacts with conductive regions of the first substrate, wherein after the contacting the contacts extend through the first openings;
- and
- bonding the contacts with the conductive regions.
Dependencies are inferred from the claim text.