Contact Pad for Semiconductor Devices
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJie Chen, Hsien-Wei Chen, Ying-Ju Chen
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Abstract
Packaging devices and methods of manufacture thereof for semiconductor devices are disclosed. In some embodiments, a packaging device includes a contact pad disposed over a substrate, and a passivation layer and/or polymer layer disposed over the substrate and a portion of the contact pad. A post passivation interconnect (PPI) line is disposed over the passivation layer and is coupled to an exposed portion of the contact pad. A PPI pad is disposed over the passivation layer. A transition element is disposed over the passivation layer and is coupled between the PPI line and the PPI pad. The transition element includes a stepped region.
Claims20
A semiconductor structure comprising:
- a substrate having a contact pad thereon;
- a passivation layer over the substrate, wherein a portion of the contact pad is exposed;
- and
- a post passivation interconnect (PPI) over the passivation layer and the exposed portion of the contact pad, the PPI being electrically coupled to the contact pad, the PPI comprising a PPI line, a PPI pad, and a transition element interposed between the PPI line and the PPI pad, the transition element having a stepped region, the stepped region having a greater width than the PPI line.
A semiconductor structure comprising:
- a substrate having a conductive pad and one or more conductive lines formed thereon;
- and
- conductive transition elements interposed between the conductive pad and each of the one or more conductive lines, each of the transition elements having a stepped region, the stepped region having one or more steps wherein each of the one or more steps comprises a conductive line wider than respective ones of the one or more conductive lines.
A method of forming a semiconductor device, the method comprising:
- providing a substrate having a contact pad thereon;
- forming one or more dielectric layers over the substrate, wherein a portion of the contact pad is exposed;
- and
- forming a post-passivation interconnect (PPI) over the passivation layer and the exposed portion of the contact pad, the PPI comprising:
- a PPI pad;
- a PPI line extending from the contact pad toward the PPI pad;
- and
- a stepped region interposed between the PPI line and the PPI pad, the stepped region comprising one or more steps having a greater width than the PPI line.
Dependencies are inferred from the claim text.