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US 2015/0091189 A1Published application
Apparatuses and methods enabling concurrent communication
AssigneeMicron Technology, Inc.
InventorsBrent Keeth, Christopher K. Morzano
Life of this patent
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Abstract
Various embodiments include apparatuses having stacked devices and methods of forming dice stacks on an interface die. In one such apparatus, a dice stack includes at least a first die and a second die, and conductive paths coupling the first die and the second die to the common control die. In some embodiments, the conductive paths may be arranged to connect with circuitry on alternating dice of the stack. In other embodiments, a plurality of dice stacks may be arranged on a single interface die, and some or all of the dice may have interleaving conductive paths.
Claims20
A semiconductor device comprising:
- a dice stack including a first die, a second die and a third die stacked in order, wherein each of the first, the second and the third dice includes:
- an input-output circuit;
- and
- a plurality of through silicon vias including a first through silicon via electrically connected to the input-output circuit and a second through silicon via,
- wherein the first through silicon via of the first die is electrically coupled to the second through silicon via of the second die, the second through silicon via of the first die is electrically coupled to the first through silicon via of the second die, the first through silicon via of the third die is electrically coupled to the second through silicon via of the second die, and the second through silicon via of the third die is electrically coupled to the first through silicon via of the second die.
2 more elements
A semiconductor device comprising:
- a first die;
- a second die on the first die, the second die including a first surface facing toward the first die;
- and
- a third die on the second die, the third die including a first surface facing toward the second die, wherein each of the second die and the third die includes,
- an input-output circuit, and
- a plurality of terminals formed on the first surface, the plurality of terminals including a first terminal electrically coupled to the input-output circuit, and including a second terminal,
- wherein the second die includes a plurality of through silicon vias including a first via and a second via, wherein the first via is positioned to overlap the first terminal thereof, wherein the second via is positioned to overlap the second terminal thereof, wherein the first via of the second die is electrically connected to the second terminal of the second die and is electrically connected to the first terminal of the third die, and wherein the second via of the second die is electrically connected to the first terminal of the second die and is connected electrically to the second terminal of the third die.
4 more elements
An apparatus comprising dice including a first die and a second die stacked on each other,
- the first die comprising:
- a first input-output (TO) circuit;
- a first terminal electrically connected to the first IO circuit;
- a second terminal located apart from the first terminal;
- a first through silicon via (TSV) vertically aligned with and electrically isolated from the first terminal, the first TSV being electrically connected to the second terminal;
- and
- a second TSV vertically aligned with and electrically isolated from the second terminal, the second TSV being electrically connected to the first terminal;
- and
- the second die comprising:
- a second IO circuit;
- a third terminal electrically connected to the second IO circuit;
- a fourth terminal located apart from the third terminal;
- a third TSV vertically aligned with and electrically isolated from the third terminal, the third TSV being electrically connected to the fourth terminal;
- and
- a fourth TSV vertically aligned with and electrically isolated from the fourth terminal, the fourth TSV being electrically connected to the third terminal;
- and
- the first die and the second die being stacked on each other such that the first terminal and the second TVS of the first die and the third terminal and the fourth TSV of the second die are vertically aligned with one another, and such that the second terminal and the first TVS of the first die and the fourth terminal and the third TSV of the second die are vertically aligned with one another.
14 more elements
Dependencies are inferred from the claim text.