3d device packaging using through-substrate posts
AssigneeFreescale Semiconductor, Inc.
InventorsDouglas M. Reber, Mehul D. Shroff, Edward O. Travis
Life of this patent
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Abstract
A method for 3D device packaging utilizes through-hole metal post techniques to mechanically and electrically bond two or more dice. The first die includes a set of through-holes extending from a first surface of the first die to a second surface of the first die. The second die includes a third surface and a set of metal posts. The first die and the second die are stacked such that the third surface of the second die faces the second surface of the first die, and each metal post extends through a corresponding through-hole to a point beyond the first surface of the first die, electrically coupling the first die and the second die.
Claims20
A device package comprising:
- a first die comprising:
- a first set of through-holes in a first arrangement, each through-hole of the first set of through-holes extending between a first surface of the first die and a second surface of the first die;
- and
- a second die comprising:
- a first set of metal posts disposed at a third surface of the second die in a second arrangement corresponding to the first arrangement, the third surface facing the second surface, and each metal post of the first set of metal posts extending through a corresponding through-hole of the first set of through-holes to a point beyond the first surface of the first die.
A method comprising:
- stacking a first die and a second die, such that a first surface of the first die faces a second surface of the second die and such that each metal post of a first set of metal posts of the first die extends from the first surface of the first die beyond a third surface of the second die opposite the second surface via a corresponding through-hole of a first set of through-holes of the second die;
- and
- bonding the first die and the second die such that the metal posts of the first set of metal posts are electrically coupled to the second die.
A method comprising:
- forming a set of through-holes in a first arrangement at a first die, each through-hole of the set of through-holes extending through the first die from a first surface of the first die to a second surface of the first die;
- and
- bonding the first die and a second die, the second die comprising a set of metal posts disposed at a surface of the second die in a second arrangement corresponding to the first arrangement, the set of metal posts extending through the first die beyond the second surface via the set of through-holes.
Dependencies are inferred from the claim text.