Arrangement and method for manufacturing the same

A circuit arrangement, comprising:

• a die comprising at least one electronic component and a first terminal on a first side of the die and a second terminal on a second side of the die opposite the first side,
• the die further comprising at least a third terminal on the second side;
• a first electrically conductive structure providing current flow from the third terminal on the second side of the die to the first side of the die through the die;
• a second electrically conductive structure deposited on the first side of the die and laterally coupling the first terminal with the first electrically conductive structure, wherein the second electrically conductive structure is formed by means of a wafer level interconnect structure;
• an encapsulation material disposed at least over the first side of the die covering the first terminal and the second electrically conductive structure.

A method for manufacturing a circuit arrangement, the method comprising:

• forming a plurality of dies in a wafer, each die comprising at least one electronic component and a first terminal on a first side of the wafer and a second terminal on a second side of the wafer opposite the first side, each die further comprising at least a third terminal on the second side, the first side being the main processing side of the die;
• forming a first electrically conductive structure through each die providing current flow from a respective third terminal on the second side of the die to the first side through the respective die;
• forming a second electrically conductive structure on the first side of each die laterally coupling the respective first terminal with the respective first electrically conductive structure;
• and
• forming encapsulation material over the first side of the wafer covering the plurality of dies.