Package on wide i/o silicon

An apparatus comprising:

• a die comprising a device side and an opposite backside, a first plurality of contacts on the backside and a plurality of through vias from the device side to the first plurality of contacts and a different second plurality of contacts on one of the backside of the die and on at least two opposing sidewalls of the die;
• a secondary die coupled to the first plurality of contacts;
• a carrier comprising on a device side of the die at least one patterned layer of conductive material disposed in dielectric material, a first plurality of carrier contact points operable for mounting the carrier to a substrate, and a second plurality of carrier contact points on a side opposite a side of the first plurality of carrier contact points, at least ones of the second plurality of carrier contact points coupled to the second plurality of contacts of the die, wherein the carrier comprises a dielectric material disposed between respective ones of the second plurality of contacts of the die and the second plurality of carrier contact points, the dielectric material embedding at least opposing sides of the secondary die;
• and
• a tertiary die coupled to the second plurality of contacts.