External connection terminal, semiconductor package having external connection terminal, and methods for manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsChang Seob Hong, Eun Jung Jo, Kyu Hwan Oh, Kang Hyun Lee
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Abstract
Disclosed herein are an external connection terminal part, a semiconductor package having the external connection terminal part, and a method for manufacturing the same. According to a preferred embodiment of the present invention, the external connection terminal part includes an insulating material and metal plating pattern formed on both surfaces of the insulating material.
Claims20
An external connection terminal part, comprising:
- an insulating material;
- and
- metal plating patterns formed on both sides of the insulating material,
- wherein a whole lower and upper surfaces of the insulating material are exposed.
A method for manufacturing an external connection terminal part, comprising:
- preparing an insulating material;
- forming metal plating patterns on both sides of the insulating material;
- and
- exposing surfaces of the metal plating pattern by exposing a whole lower and upper surfaces of the insulating material, which face each other.
A semiconductor package, comprising:
- a substrate on which a double-sided mounting electrode is formed;
- a plurality of electronic devices mounted on both surfaces of the substrate;
- and
- external connection terminal parts each attached to outer sides of a lower surface of the substrate,
- wherein the external connection terminal part includes a resin in which a glass fiber is impregnated and metal plating patterns formed on both surfaces of the resin.
A method for manufacturing a semiconductor package, comprising:
- mounting a plurality of electronic devices on an upper surface of a substrate on which a double-sided mounting electrode is formed;
- mounting the plurality of electronic devices on a lower surface of the substrate;
- and
- attaching external connection terminal parts each disposed at outer sides of a lower surface of the substrate,
- wherein the external connection terminal part includes a resin in which a glass fiber is impregnated and metal plating patterns formed on both surfaces of the resin.
Dependencies are inferred from the claim text.