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US 2015/0091176 A1Published application
Electronic Component, Arrangement and Method
AssigneeInfineon Technologies Austria AG
InventorsRalf Otremba, Josef Höglauer, Jürgen Schredl, Xaver Schlögel, Klaus Schiess
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Abstract
An electronic component includes at least one semiconductor device and a redistribution board comprising at least two nonconductive layers and a conductive redistribution structure. The semiconductor device is embedded in the redistribution board and electrically coupled to the redistribution structure and the redistribution board has a side face with a step. An outer contact pad of the redistribution structure is arranged on the step.
Claims20
An electronic component, comprising:
- at least one semiconductor device;
- and
- a redistribution board comprising at least two nonconductive layers and a conductive redistribution structure,
- wherein the semiconductor device is embedded in the redistribution board and electrically coupled to the redistribution structure and the redistribution board has a side face with a step and an outer contact pad of the redistribution structure is arranged on the step.
1 more element
An arrangement, comprising:
- a circuit board comprising a plurality of non-conductive layers, a redistribution structure and at least one cavity including a step comprising a contact pad electrically coupled to the redistribution structure;
- and
- an electronic device comprising at least one semiconductor device embedded in a redistribution board, the redistribution board having a side face with a step and an outer contact pad arranged on the step,
- wherein the electronic device is mounted in the cavity and the outer contact pad of the electronic component is mounted on the contact pad of the circuit board.
1 more element
A method, comprising:
- providing an electronic component comprising at least one semiconductor device embedded in a redistribution board having at least two nonconductive core layers and at least one conductive layer;
- and
- removing a peripheral portion of a core layer and exposing a portion of a conductive layer on another core layer and forming an outer contact pad for the electronic device.
Dependencies are inferred from the claim text.