Semiconductor device

A semiconductor device comprising:

• a wiring board including a first surface, a second surface opposite to the first surface, and wiring patterns, each of the wiring patterns comprises a connection pad formed on the first surface, a land formed on the second surface, a through via formed in the wiring board, a first wiring electrically connected the connection pad to the through via and a second wiring electrically connected the land to the through via;
• and
• a semiconductor chip mounted over the first surface of the wiring board, the semiconductor chip including a plurality of electrodes thereon, the electrodes being electrically connected to the connection pads of the wiring patterns, and the electrodes including signal electrodes, power-supply electrodes and ground electrodes,
• wherein the wiring patterns include signal wiring patterns electrically connected to the signal electrodes, power-supply wiring patterns electrically connected to the power-supply electrodes and ground wiring patterns electrically connected to the ground electrodes, and at least one of the signal wiring patterns is shorter than immediately adjacent one of the power-supply wiring patterns or the ground wiring patterns.

A semiconductor device, comprising:

• a wiring board defined by a first major surface, a second major surface facing the first major surface, and a plurality of side surfaces;
• a semiconductor chip mounted on the first major surface, having a side surface facing one side surface of the plurality of side surfaces, and having a plurality of electrodes arranged along the faced side surface;
• a plurality of connection pads provided on the first major surface of the wiring board between the one side surface of the wiring board and the faced side surface of the semiconductor chip and electrically connected to the plurality of electrodes of the semiconductor chip;
• a plurality of external terminals provided on the second major surface of the wiring board, along and close to the one side surface of the wiring board;
• a plurality of first through vias formed in the wiring board to penetrate from the first major surface to the second major surface in positions overlapping with the semiconductor chip;
• a plurality of first wirings formed on the first major surface of the wiring board to electrically connect the first connection pads to the first through vias;
• and
• a plurality of second wirings formed on the second major surface to electrically connect the external terminals to the first through vias,
• wherein:
• the electrodes include signal electrodes and power-supply and ground electrodes,
• the first through vias include a plurality of signal through vias electrically connected to the signal electrodes, and a plurality of power-supply and ground through vias electrically connected to the power-supply and ground electrodes, and,
• the signal through vias are arranged at positions closer to at least the one side surface than the power-supply and ground through vias adjacent to the respective signal through vias.