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US 2015/0091164 A1Published application
Semiconductor device
AssigneeRohm Co., Ltd.
InventorsMamoru YAMAGAMI, Kenji FUJII
Life of this patent
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Abstract
An inventive semiconductor device includes: a semiconductor chip including an integrated circuit; a plurality of electrode pads provided on the semiconductor chip and connected to the integrated circuit; a rewiring to which the electrode pads are electrically connected together, the rewiring being exposed on an outermost surface of the semiconductor chip and having an exposed surface area greater than the total area of the electrode pads; and a resin package which seals the semiconductor chip.
Claims22
A semiconductor device comprising:
- a semiconductor chip including an integrated circuit;
- a plurality of electrode pads provided on the semiconductor chip and connected to the integrated circuit;
- a rewiring to which the electrode pads are electrically connected together, the rewiring being exposed on an outermost surface of the semiconductor chip and having an exposed surface area greater than a total area of the electrode pads;
- and
- a resin package which seals the semiconductor chip.
2 more elements
Dependencies are inferred from the claim text.