3d device packaging using through-substrate posts
AssigneeFreescale Semiconductor, Inc.
InventorDouglas M. Reber
Life of this patent
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Abstract
A method for 3D device packaging utilizes through-substrate metal posts to mechanically and electrically bond two or more dice. The first die includes a set of access holes extending from a surface of the first die to a set of pads at a metal layer of the first die. The second die includes a set of metal posts. The first die and the second die are stacked such that each metal post extends from a surface of the second die toward a corresponding pad via a corresponding access hole. The first die and second die are mechanically and electrically bonded via solder joints formed between the metal posts and the corresponding pads.
Claims20
A method comprising:
- stacking a first die with a second die, the first die comprising a first set of access holes extending from a first surface of the first die to a first set of pads at a metal layer of the first die and the second die comprising a first set of metal posts, each metal post of the first set of metal posts extending from a surface of the second die toward a first surface of a corresponding pad of the first set of pads via a corresponding access hole of the first set of access holes;
- and
- bonding the first die and the second die such that the metal posts of the first set of metal posts are electrically coupled to the corresponding pads of the first set of pads.
A method comprising:
- providing a first die comprising:
- a first set of pads at a metal layer of the first die;
- a set of access holes in a first arrangement at the first die, each access hole of the set of access holes extending from a surface of the first die to a corresponding pad of the set of pads;
- and solder material at a corresponding pad of each access hole of the set of access holes;
- and
- bonding the first die to a second die, the second die comprising a set of stud bumps disposed at a surface of the second die in a second arrangement corresponding to the first arrangement, the set of stud bumps extending into the first die via the set of access holes such that each stud bump of the set of stud bumps contacts the solder material at a corresponding pad of the set of pads.
A device package comprising:
- a first die comprising:
- a first metal layer comprising a first set of pads;
- and
- a set of access holes in a first arrangement, each access hole of the set of access holes extending from a first surface of the first die to a first surface of a corresponding pad of the first set of pads;
- and
- a second die bonded to the first die, the second die comprising:
- a first set of metal posts disposed in a second arrangement corresponding to the first arrangement at a surface of the second die that faces the surface of the first die, each metal post of the first set of metal posts extending toward and electrically coupled to the first surface of a corresponding pad of the set of pads via a corresponding access hole of the set of access holes.
Dependencies are inferred from the claim text.