Package structure
AssigneeMediatek Inc.
InventorsTzu-Hung Lin, Yu-Hua Huang, Wei-Che Huang, Ming-Tzong Yang
Life of this patent
Estimating the term…
Abstract
A package structure, comprising: a substrate, having at least one conductive units provided at a first surface of the substrate; at least one first die, provided on a second surface of the substrate; a connecting layer; a second die, provided on the connecting layer, wherein the connecting layer comprises at least one bump for connecting the first die to the second die such that the first die and the second die are electrically connected; and at least one bonding wire, for electrically connecting the first die to the conductive units or the substrate.
Claims17
A package structure, comprising:
- a substrate, having at least one conductive units provided at a first surface of the substrate;
- at least one first die, provided on a second surface of the substrate;
- a connecting layer, comprising:
- a single metal layer located between the first die and the second die, wherein the single metal layer touches the first die and the second die;
- and
- at least one micro bump, for connecting the first die and the second die, wherein the single metal layer is surrounding the micro bump;
- a second die, provided on the connecting layer, wherein the connecting layer comprises at least one bump for connecting the first die to the second die such that the first die and the second die are electrically connected;
- and
- at least one bonding wire, for electrically connecting the first die to the conductive units or the substrate.
(canceled)
Dependencies are inferred from the claim text.