Substrateless packages with scribe disposed on heat spreader

A substrateless semiconductor package comprising:

• a heat spreader having a heat dissipating surface and a die attaching surface, wherein a plurality of scribe line grooves are formed on the heat dissipating surface, wherein a plurality of first openings are formed inside the scribe line grooves so that the scribe line grooves are physically connected to the die attaching surfaces;
• a chip disposed on the die attaching surface of the heat spreader, wherein a plurality of external pads are formed on a first surface of the chip away from the heat spreader;
• and
• an encapsulant formed on the die attaching surface of the heat spreader to encapsulate the first surface of the chip without encapsulate the external pads, wherein the encapsulant is also filled in the scribe line grooves by flowing through the first openings in a manner to form a scribe line pattern exposed from heat dissipating surface.