External connection terminal, semiconductor package having external connection terminal and method of manufacturing the same
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsEun Jung JO, Chang Seob HONG, Kyu Hwan OH, Kang Hyun LEE
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Abstract
Disclosed herein are an external connection terminal, a semiconductor package having the external connection terminal, and a method of manufacturing the same. The external connection terminal includes an internal insulating material, an external insulating material formed to enclose the internal insulating material, and metal lines formed between the internal insulating material and the external insulating material.
Claims21
An external connection terminal, comprising:
- an internal insulating material;
- an external insulating material formed to enclose the internal insulating material;
- and
- metal lines formed between the internal insulating material and the external insulating material.
A method of manufacturing an external connection terminal, comprising:
- preparing an internal insulating material;
- forming metal lines on the internal insulating material;
- and
- forming an external insulating material to enclose the internal insulating material and the metal lines.
A semiconductor package, comprising:
- a substrate formed with a double-sided mounting electrode;
- a plurality of electronic elements mounted on both surfaces of the substrate;
- and
- external connection terminals each bonded to an outer side of a lower surface of the substrate,
- wherein the external connection terminal includes an internal insulating material, an external insulating material, and metal lines which are formed between the internal insulating material and the external insulating material.
A method of manufacturing a semiconductor package, comprising:
- mounting a plurality of electronic elements on an upper surface of a substrate on which a double-sided mounting electrode is formed;
- mounting a plurality of electronic elements on a lower surface of the substrate;
- and
- bonding each of the external connection terminals to an outer side of a lower surface of the substrate,
- wherein the external connection terminal includes an internal insulating material, an external insulating material, and metal lines which are formed between the internal insulating material and the external insulating material.
Dependencies are inferred from the claim text.