Power Semiconductor Arrangement and Method of Producing a Power Semiconductor Arrangement

A method for producing a power semiconductor device, the method comprising the following steps:

• a) providing a power semiconductor module having
• electrically conductive conductor tracks with at least one power semiconductor component arranged thereon;
• a cooling plate, said cooling plate having a main surface facing said at least one power semiconductor component and a lateral first surface which extends circumferentially around said cooling plate and is at an angle (α) of less than about 90° with respect to said main surface of said cooling plate;
• and
• an electrically non-conductive insulation layer arranged between said conductor tracks and said cooling plate;
• b) providing a heat sink through which a liquid can flow, said heat sink having an opening therein and a lateral first surface which delimits said opening and extends circumferentially around said opening;
• c) arranging said cooling plate in said opening;
• and
• d) press-fitting said cooling plate into said opening so that said lateral first surface of said cooling plate and said lateral first surface of said heat sink are pressed against one another and extend circumferentially along said lateral first surface of said cooling plate and extend circumferentially along said lateral first surface of said heat sink;
• wherein said first surface of said heat sink is at an angle (β) of less than about 90° with respect to said main surface of said cooling plate.