Back to results
US 2015/0091148 A1Published application
Explosion-Protected Semiconductor Module
AssigneeInfineon Technologies AG
InventorsGuido Boenig, Olaf Hohlfeld
Life of this patent
Estimating the term…
Abstract
A semiconductor module has a carrier, a semiconductor chip mounted on the carrier, a bond wire, a module housing, and a first sound absorber. The module housing has a housing side wall. The bond wire is arranged in the module housing. At least a section of the first sound absorber is arranged between the semiconductor chip and the housing side wall.
Claims20
A semiconductor module, comprising:
- a carrier;
- a semiconductor chip mounted on the carrier;
- a bond wire;
- a module housing;
- and
- a first sound absorber,
- wherein the module housing has a housing side wall,
- wherein the bond wire is arranged in the module housing,
- wherein at least a section of the first sound absorber is arranged between the semiconductor chip and the housing side wall.
6 more elements
Dependencies are inferred from the claim text.