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US 2015/0091147 A1Published application
Semiconductor package
AssigneeMediatek Inc.
InventorNan-Jang Chen
Life of this patent
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Abstract
A semiconductor package includes a die pad, wherein a semiconductor die is mounted on the die pad; a plurality of leads comprising a power lead disposed along a peripheral edge of the die pad; at least one connecting bar connecting with the die pad; and a power bar disposed on one side of the connecting bar, wherein the power bar is integrally connected to the power lead. A capacitor is mounted between the power bar and the connecting bar.
Claims14
A semiconductor package, comprising:
- a die pad, wherein a semiconductor die is mounted on the die pad;
- a plurality of leads comprising a power lead disposed along a peripheral edge of the die pad;
- at least one connecting bar connecting with the die pad;
- and
- a power bar disposed on one side of the connecting bar, wherein
- the power bar is integrally connected to the power lead;
- wherein a capacitor is mounted between the power bar and the connecting bar.
4 more elements
A semiconductor package, comprising:
- a die pad, wherein a semiconductor die is mounted on the die pad;
- a plurality of leads comprising a power lead disposed along a peripheral edge of the die pad;
- at least one connecting bar connecting the die pad;
- and
- a power bar disposed on one side of the connecting bar, wherein
- the power bar is integrally connected to the power lead;
- wherein a capacitor is mounted between the power bar and the die pad.
4 more elements
A semiconductor package, comprising:
- a die pad, wherein a semiconductor die is mounted on the die pad;
- a plurality of leads comprising a power lead disposed along a peripheral edge of the die pad;
- at least one connecting bar connecting the die pad;
- a ground bar disposed on one side of the connecting bar, wherein
- the ground bar is integrally connected to the connecting bar;
- and
- a power bar disposed on one side of the connecting bar, wherein
- the power bar is integrally connected to the power lead;
- wherein a capacitor is mounted between the power bar and the ground bar.
6 more elements
A semiconductor package, comprising:
- a die pad;
- a semiconductor die mounted on the die pad;
- a plurality of leads comprising a power lead disposed along a peripheral edge of the die pad;
- at least one connecting bar connecting the die pad;
- a power bar disposed on one side of the connecting bar, wherein
- the power bar is integrally connected to the power lead;
- and
- a capacitor comprising a first terminal and a second terminal, wherein the first terminal is electrically connected to the power bar and the second terminal is electrically connected a ground level.
5 more elements
Dependencies are inferred from the claim text.