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US 2015/0091146 A1Published application
Power semiconductor package
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsKyu Hwan Oh, Si Joong Yang, Do Jae Yoo, Young Hoon Kwak
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Abstract
Disclosed herein is a power semiconductor package. The power semiconductor package according to a preferred embodiment of the present invention includes: a semiconductor device; a circuit pattern formed on the semiconductor device; a molding member burying the semiconductor device and the circuit pattern and formed so as to expose one surface of the circuit pattern; and a heat radiating member adhered to the circuit pattern exposed by the molding member and formed of a non-conductive material.
Claims15
A power semiconductor package, comprising:
- a semiconductor device;
- a circuit pattern formed on the semiconductor device;
- a molding member burying the semiconductor device and the circuit pattern and formed so as to expose one surface of the circuit pattern;
- and
- a heat radiating member adhered to the circuit pattern exposed by the molding member and formed of a non-conductive material.
2 more elements
Dependencies are inferred from the claim text.