Semiconductor device and method of manufacturing the same
AssigneeSeiko Instruments Inc.
InventorYasuhiro TAGUCHI
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Abstract
Provided is a semiconductor device capable of being firmly bonded to a substrate. An outer lead (11) exposed from an encapsulating resin (5) of a flat lead package includes: a distal end in which a through recessed portion (2x) covered with a thick plated layer is formed; and a bottom surface on which an inclined portion (6) covered with a thick plated layer is formed. The cutting area of the distal end of the outer lead is accordingly reduced.
Claims7
A semiconductor device, comprising:
- an encapsulating resin for covering a semiconductor chip;
- an outer lead extending from a side surface of the encapsulating resin;
- an inclined portion formed in a bottom surface of the extending outer lead;
- a through recessed portion formed in an end surface of the outer lead, the end surface corresponding to a distal end of the outer lead, the through recessed portion vertically passing through the outer lead;
- a thick plated layer for covering the inclined portion and an inner surface of the through recessed portion;
- and
- a thin plated layer for covering the end surface.
A method of manufacturing a semiconductor device comprising an encapsulating resin for covering a semiconductor chip, and an outer lead extending from a side surface of the encapsulating resin, the method comprising:
- forming a through hole in the outer lead;
- forming exterior plating on the outer lead after the through hole is formed;
- forming an inclined portion in a lower surface of the through hole after the exterior plating is formed;
- and
- forming a through recessed portion in a distal end of the outer lead at the same time when the outer lead is cut so as to cross the through hole after the inclined portion is formed.
Dependencies are inferred from the claim text.