US 2015/0091143 A1Published application

Semiconductor device and electronic unit provided with the same

AssigneeRohm Co., Ltd.

InventorsKenji FUJII, Mamoru YAMAGAMI

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Abstract

A semiconductor device includes first and semiconductor elements, an electroconductive support member including electroconductive elements, and a resin package. The first semiconductor element includes a first active surface and first electrodes formed on the first active surface. The second semiconductor element includes a second active surface and second electrodes formed on the second active surface. The electroconductive support member is electrically connected to the first and second semiconductor elements and support these elements. The resin package covers the first and second semiconductor elements. The second semiconductor element is located between the first semiconductor element and the electroconductive support member. The first electrodes of the first semiconductor element and the electroconductive elements are connected by wire. An electroconductive bonding material is also provided that bonds the second electrodes of the second semiconductor element and the electroconductive elements to which the wire is bonded.

Claims20

Dependent claims

A semiconductor device comprising:

a first semiconductor element including a first active surface and a plurality of first electrodes formed on the first active surface;
a second semiconductor element including a second active surface and a plurality of second electrodes formed on the second active surface;
an electroconductive support member electrically connected to the first semiconductor element and the second semiconductor element while supporting the first semiconductor element and the second semiconductor element, the electroconductive support member including a plurality of electroconductive elements;
and
a resin package covering the first semiconductor element and the second semiconductor element;
wherein the second semiconductor element is located between the first semiconductor element and the electroconductive support member, and
the semiconductor device further comprises a wire connected to the first electrode of the first semiconductor element and the electroconductive element, and an electroconductive bonding material that bonds the second electrode of the second semiconductor element and the electroconductive element to which the wire is bonded.

4 more elements

Dependencies are inferred from the claim text.