Semiconductor device and method for fabricating the same
AssigneeSamsung Electronics Co., Ltd.
InventorsKyu-Ho Cho, Hyun-Jeong Yang, Se-Hoon Oh, Yong-Jae Lee, Ki-Vin IM, Jae-Soon Lim, Han-Jin Lim, Jae-Wan Chang, Chang-Hwa Jung
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Abstract
In a semiconductor device and in methods of formation thereof, a semiconductor device comprises a substrate, a lower electrode on the substrate, and a dielectric layer on the lower electrode. An adhesion layer is positioned on the dielectric layer and an upper electrode is positioned on the adhesion layer. The adhesion layer contacts the dielectric layer and the upper electrode, and comprises a conductive material.
Claims20
A semiconductor device comprising:
- a substrate;
- a lower electrode on the substrate;
- a dielectric layer on the lower electrode;
- an adhesion layer on the dielectric layer;
- and
- an upper electrode on the adhesion layer,
- wherein the adhesion layer contacts the dielectric layer and the upper electrode, and comprises a conductive material.
A semiconductor device comprising:
- a substrate;
- a conductive lower electrode on the substrate and having a 3D structure;
- a conformal dielectric layer on the lower electrode and including a high-k material;
- an conformal adhesion layer on the dielectric layer;
- and
- a conductive upper electrode on the conformal adhesion layer,
- wherein the conformal adhesion layer contacts the conformal dielectric layer and the upper electrode, and comprises a conductive material.
A capacitor structure comprising:
- a conductive lower electrode having a 3D structure on a substrate, the 3D structure including vertical portions that extend in a vertical direction of extension, relative to a horizontal direction of extension of the substrate;
- a conformal dielectric layer on the lower electrode and including a high-k material, the conformal dielectric layer covering at least the vertical portions of the 3D structure;
- a conformal adhesion layer on, and in contact with, the dielectric layer, the conformal adhesion layer covering at least portions of the conformal dielectric layer that in turn cover the vertical portions of the 3D structure, the conformal adhesion layer comprising a conductive material having an RMS surface roughness of less than about 1 nm;
- and
- a conductive upper electrode on, and in contact with, the conformal adhesion layer.
Dependencies are inferred from the claim text.