Image pickup element, method of manufacturing image pickup element, and electronic apparatus
AssigneeSony Corporation
InventorsShuji Manda, Susumu Hiyama, Yasuyuki Shiga
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AssigneeSony Corporation
InventorsShuji Manda, Susumu Hiyama, Yasuyuki Shiga
Estimating the term…
An image pickup element includes: a semiconductor substrate including a photoelectric conversion section for each pixel; a pixel separation groove provided in the semiconductor substrate; and a fixed charge film provided on a light-receiving surface side of the semiconductor substrate, wherein the fixed charge film includes a first insulating film and a second insulating film, the first insulating film being provided contiguously from the light-receiving surface to a wall surface and a bottom surface of the pixel separation groove, and the second insulating film being provided on a part of the first insulating film, the part corresponding to at least the light-receiving surface.
An image pickup element comprising:
A method of manufacturing an image pickup element, the method comprising
An electronic apparatus provided with an image pickup element, the image pickup element comprising:
Dependencies are inferred from the claim text.