Imaging devices with partitions in photoelectric conversion layer
AssigneeVisEra Technologies Company Limited
InventorsChi-Han LIN, Chih-Kung CHANG, Hsin-Wei MAO
Life of this patent
Estimating the term…
Abstract
An imaging device is provided. The imaging device includes a substrate containing a first photodiode and a second photodiode formed thereon. A photoelectric conversion layer including a first zone and a second zone is disposed above the substrate. Further, an insulating partition is disposed between the first zone and the second zone of the photoelectric conversion layer. A first electrode is disposed under the first zone and a second electrode is disposed under the second zone of the photoelectric conversion layer. In addition, an electrical interconnection is disposed on the photoelectric conversion layer.
Claims22
An imaging device, comprising:
- a substrate containing a first photodiode and a second photodiode formed thereon;
- a photoelectric conversion layer, including a first zone and a second zone, disposed above the substrate;
- an insulating partition disposed between the first zone and the second zone of the photoelectric conversion layer;
- a first electrode disposed under the first zone and a second electrode disposed under the second zone of the photoelectric conversion layer;
- an electrical interconnection disposed on the photoelectric conversion layer;
- and
- a color filter disposed above the electrical interconnection,
- wherein the insulating partition is disposed in the photoelectric conversion layer and does not extend to the electrical interconnection, the color filter, and the first and second electrodes.
An imaging device, comprising:
- a semiconductor substrate containing a plurality of photodiodes formed thereon;
- a photoelectric conversion layer, including a plurality of zones, disposed above the semiconductor substrate;
- a plurality of insulating partitions disposed in the photoelectric conversion layer, wherein each of the partitions is disposed between any two adjacent zones of the photoelectric conversion layer;
- a plurality of electrodes disposed between the photoelectric conversion layer and the semiconductor substrate, wherein each of the electrodes individually corresponds to one zone of the photoelectric conversion layer and electrically connects to one of the photodiodes;
- an electrical interconnection disposed on the photoelectric conversion layer;
- and
- a color filter array disposed over the electrical interconnection,
- wherein the insulating partitions do not extend to the electrical interconnection, the color filter array and the electrodes.
Dependencies are inferred from the claim text.