Package structure and manufacturing method thereof
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChing-Han HUANG, Lu-Ming LAI
Life of this patent
Estimating the term…
Abstract
The present disclosure provides a package structure and a manufacturing method. The package structure includes a substrate, a cover, a conductive pattern, and a sensing component. The cover is disposed on the substrate. The cover and the substrate define an accommodation space. The conductive pattern includes a conductive line. The conductive line is disposed on an internal surface of the cover exposed by the accommodation space, and is electrically connected to the substrate. The sensing component is disposed on the internal surface of the cover, and is electrically connected to the conductive line.
Claims23
A package structure, comprising:
- a substrate;
- a cover disposed on the substrate, the cover and the substrate defining an accommodation space;
- a conductive pattern comprising a conductive line, the conductive line disposed on an internal surface of the cover facing the accommodation space, and electrically connected to the substrate;
- and
- a sensing component disposed on the internal surface of the cover, and electrically connected to the conductive line.
A package structure, comprising:
- a substrate;
- a polymeric cover mounted to the substrate to define an accommodation space therebetween, the polymeric cover defining a sensing channel;
- a conductive pattern disposed on an internal surface of the polymeric cover facing the accommodation space;
- and
- a conductive joint disposed between the polymeric cover and the substrate and electrically connecting the conductive pattern to the substrate.
A manufacturing method of a package structure, comprising:
- providing a cover, the cover defining an accommodation space;
- forming a conductive line on an internal surface of the cover facing the accommodation space;
- disposing a sensing component on the internal surface of the cover, and electrically connecting the sensing component to the conductive line;
- and
- disposing the cover on a substrate, the accommodation space facing the substrate.
Dependencies are inferred from the claim text.