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US 2015/0091070 A1Published application
Semiconductor device with buried bit line and method for fabricating the same
AssigneeSK hynix Inc.
InventorsHeung-Jae CHO, Eui-Seong HWANG, Eun-Shil PARK
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Abstract
A method for fabricating a semiconductor device includes etching a semiconductor substrate to form bulb-type trenches that define a plurality of active regions in the semiconductor substrate; forming a supporter in each of the bulb-type trenches; dividing each active region, of the plurality of active regions, into a pair of body lines by forming a trench through each active region; and forming a bit line in each body line of the pair of body lines.
Claims8
1-14. (canceled)
A semiconductor device comprising:
- a semiconductor substrate,
- an active region, including a body, formed on a surface of the semiconductor substrate;
- a pillar formed on the body;
- a supporter buried the active region;
- and
- a buried bit line formed in the body.
3 more elements
Dependencies are inferred from the claim text.