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US 2015/0091044 A1Published application
Semiconductor light emitting device and method for manufacturing the same
AssigneeRohm Co., Ltd.
InventorsMasahiko KOBAYAKAWA, Kazuhiro MIREBA, Shintaro YASUDA, Junichi ITAI, Taisuke OKADA
Life of this patent
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Abstract
A semiconductor light emitting device includes a semiconductor light source, a resin package surrounding the semiconductor light source, and a lead fixed to the resin package. The lead is provided with a die bonding pad for bonding the semiconductor light source, and with an exposed surface opposite to the die bonding pad The exposed surface is surrounded by the resin package in the in-plane direction of the exposed surface.
Claims13
1-8. (canceled)
A semiconductor light emitting device comprising:
- at least one semiconductor light emitting element;
- a main lead including an upper surface on which the semiconductor light emitting element is mounted;
- a plurality of sub-leads each spaced apart from the main lead;
- and
- a resin package covering at least partially each of the main leads and the plurality of sub-leads;
- wherein the plurality of sub-leads include:
- a first sub-lead and a second sub-lead spaced apart from each other with the main lead intervening therebetween in a first direction parallel to the upper surface of the main lead;
- a third sub-lead and a fourth sub-lead spaced apart from each other with the main lead intervening therebetween in the first direction;
- and a fifth sub-lead and a sixth sub-lead spaced apart from each other with the main lead intervening therebetween in the first direction;
- wherein the third sub-lead and the fifth sub-lead are spaced apart from each other with the first sub-lead intervening therebetween in a second direction perpendicular to the first direction, and the fourth sub-lead and the sixth sub-lead are spaced apart from each other with the second sub-lead intervening therebetween in the second direction, and
- wherein the main lead is arranged not to overlap any one of the first through the sixth sub-leads as viewed in a normal direction of the upper surface of the main lead.
8 more elements
Dependencies are inferred from the claim text.