Semiconductor light-emitting device

A semiconductor light-emitting device comprising:

• a first lead frame;
• a second lead frame spaced apart from the first lead frame in a first direction;
• a semiconductor light-emitting element bonded to the first lead frame and electrically connected to the second lead frame;
• and
• a case covering a part of each of the first lead frame and the second lead frame and made of a white resin capable of reflecting light of the semiconductor light-emitting element;
• wherein the first lead frame and the second lead frame include a first terminal portion and a second terminal portion, respectively, both of the first terminal portion and the second terminal portion protruding from the case in a plan view,
• the case has a rectangular form in a plan view, having an edge extending in the first direction and an edge extending in a second direction perpendicular to the first direction, the case including a frame portion that surrounds the semiconductor light-emitting element and has an inner wall surface constituting a reflector for reflecting the light of the semiconductor light-emitting element in a light-emitting direction,
• the light-emitting element, a part of the first lead frame and a part of the second lead frame are exposed from the case through an opening defined by the reflector,
• a transparent resin is filled in the opening to cover the semiconductor light-emitting element, the transparent resin allowing the light of the semiconductor light-emitting element to pass therethrough,
• the first lead frame comprises a bonding portion having:
• an obverse surface located in the opening in a plan view and to which the semiconductor light-emitting element is bonded;
• and a first reverse surface opposite to the obverse surface and exposed from the case;
• the first lead frame further comprising a first extension formed integral with the bonding portion and extending from the bonding portion to a region overlapping the frame portion in a plan view, the first extension having:
• an upper surface oriented to face in a third direction perpendicular to both the first direction and the second direction in a same manner as the obverse surface;
• and a first covered surface oriented to face in the third direction in a same manner as the first reverse surface of the first lead frame;
• the first covered surface of the first extension is parallel to the first reverse surface of the bonding portion and offset toward the light-emitting direction in the third direction relative to the first reverse surface of the bonding portion,
• the case covers, at the frame portion, the upper surface of the first extension in close contact therewith, and also includes a first holding portion covering, the lint covered surface of the first extension in close contact therewith,
• the first terminal portion, the second terminal portion and the bonding portion have a same thickness, and the first terminal portion, the second terminal portion, the bonding portion and the first holding portion are flush with each other, and
• the first lead frame as a whole is not greater in thickness than the first terminal portion.

A semiconductor light-emitting device comprising:

• a first lead frame;
• a second lead frame spaced apart from the first lead frame in a first direction;
• a semiconductor light-emitting element bonded to the first lead frame and electrically connected to the second lead frame;
• and
• a case covering a part of each of the first lead frame and the second lead frame;
• wherein the first lead frame and the second lead frame include a first terminal portion and a second terminal portion, respectively, both of the first terminal portion and the second terminal portion protruding from the case in a plan view,
• the case comprises a frame portion surrounding the semiconductor light-emitting element in the first direction and a second direction perpendicular to the first direction, the frame portion having an inner wall surface constituting a reflector for reflecting light of the semiconductor light-emitting element in a light-emitting direction,
• the light-emitting element, a part of the first lead frame and a part of the second lead frame are exposed from the case through an opening defined by the reflector,
• a transparent resin is filled in the opening to cover the semiconductor light-emitting element, the transparent resin allowing the light of the semiconductor light-emitting element to pass therethrough,
• the first lead frame comprises a bonding portion having:
• an obverse surface located in the opening in a plan view and to which the semiconductor light-emitting element is bonded;
• and a first reverse surface opposite to the obverse surface and exposed from the case;
• and the first lead frame also comprises a first extension formed integral with the bonding portion and extending from the bonding portion to a region overlapping the frame portion in a plan view, the first extension having:
• an upper surface oriented to face in a third direction perpendicular to both the first direction and the second direction in a same manner as the obverse surface:
• and a first covered surface oriented to face in the third direction in a same manner as the first reverse surface of the first lead frame;
• the first covered surface of the first extension is offset toward the light-emitting direction in the third direction relative to the first reverse surface of the bonding portion,
• the case covers, at the frame portion, the upper surface of the first extension in close contact therewith and also includes a first holding portion that covers the first covered surface of the first extension in close contact therewith,
• the first terminal portion, the second terminal portion and the bonding portion are the same in thickness, and the first terminal portion, the second terminal portion, the bonding portion. and the first holding portion are flush with each other, and
• the first lead flame as a whole is not greater in thickness than the first terminal portion.