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US 2015/0091035 A1Published application
Semiconductor device structure
AssigneeCtlab Co. Ltd.
InventorsChang Tae Kim, Jae Sung Ko, Seok Jung Kim, Chang Hun Lee
Life of this patent
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Abstract
The present disclosure relates to a method for manufacturing a semiconductor device structure, comprising the steps of: securing the position of a semiconductor device on a plate; securing the positions of electrodes such that the electrodes face the plate; covering the semiconductor device with an encapsulating material; and separating, from the plate, the semiconductor device covered with the encapsulating material.
Claims21
-43. (canceled)
A semiconductor device structure comprising:
- a semiconductor device, including a first semiconductor layer having a first conductivity, an active layer for generating light via electron-hole recombination, and a second semiconductor layer having a second conductivity different from the first conductivity, which are stacked in the order mentioned, and a first electrode and a second electrode formed at the side where the second semiconductor layer is located;
- and
- an encapsulating material, which is made of a light-transmitting material having the a face, a bottom face opposite to the top face, and lateral faces connecting the top face and the bottom face, and surrounds the semiconductor device from the first semiconductor layer side so as to expose the first and second electrodes through the bottom face.
Dependencies are inferred from the claim text.