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US 2015/0091034 A1Published application
Light emitting diode package
AssigneeLextar Electronics Corporation
InventorsChe-Ming HSU, Wen-Kai SHAO, Liang-Ta LIN
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Abstract
A light-emitting diode (LED) package structure includes a lead frame, a LED chip, a package body, N opaque spacer and N+1 encapsulating glues. The LED chip is disposed on the lead frame; the package body covers the lead frame and exposes the LED chip. The package body has an accommodation space, divided by the N opaque spacers disposed on the LED chip into N+1 chambers. The N+1 encapsulating glues are filled into the N+1 chambers, where N is a natural number.
Claims10
A light emitting diode package, comprising:
- a lead frame comprising a die bonding area;
- a package body covering the lead frame and exposing part of the lead frame, wherein a top surface of the package body has an opening and an accommodation space concaved from the opening, wherein the accommodation space comprises a bottom surface and a sidewall surrounding the bottom surface and exposing the die bonding area of the lead frame on the bottom surface of the accommodation space;
- a light emitting diode chip emitting a first light in a wavelength λ1 mounted on the die bonding area, and the light emitting diode chip having a light emitting surface facing the opening;
- N opaque spacers vertically spaced and across disposed in the light emitting surface of the light emitting diode chip, dividing the light emitting surface into N+1 parts and dividing the accommodation space into N+1 chambers, wherein each of the chambers exposes a part of the light emitting surface of the light emitting diode chip;
- and
- N+1 encapsulating glues separately filling into each of the chamber, and the ith encapsulating glue comprising an ith wavelength converting material,
- wherein i and N are both natural numbers, and 1≦i≦N+1.
4 more elements
Dependencies are inferred from the claim text.